User's Manual

Bluetooth Low Energy Module
Shanghai Ehong Technologies Co., Ltd
1. Contents
1. Description .................................................................................................................................................. 3
2. Applications ................................................................................................................................................ 4
3. EH-MC10 Product numbering .................................................................................................................. 4
4. Electrical Characteristics ......................................................................................................................... 4
4.1. Recommended Operation Conditions ................................................................................................. 4
4.2. Absolute Maximum Rating ................................................................................................................... 5
4.3. Input/Output Terminal Characteristics ................................................................................................ 5
4.4. Power Consumption ............................................................................................................................. 6
5.
Pinout and Terminal Description
............................................................................................................. 7
5.1. Pin Configuration .................................................................................................................................. 7
6. Physical Interfaces .................................................................................................................................... 9
6.1. Power Supply ........................................................................................................................................ 9
6.2. PIO......................................................................................................................................................... 9
6.3. AIO......................................................................................................................................................... 9
6.4. PWM ...................................................................................................................................................... 9
6.5. UART ................................................................................................................................................... 10
6.6. I2C Master........................................................................................................................................... 10
6.7. SPI Master .......................................................................................................................................... 10
6.8. SPI Debug ........................................................................................................................................... 11
7. Reference Design ..................................................................................................................................... 11
8. Layout and Soldering Considerations ................................................................................................. 11
8.1. Soldering Recommendations ............................................................................................................ 11
8.2. Layout Guidelines ............................................................................................................................... 12
9. Mechanical and PCB Footprint Characteristics ................................................................................. 13
10. Reflow Profile ........................................................................................................................................ 14
11. Contact Information ............................................................................................................................. 15