User's Manual
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Bluetooth Module
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Table Of Contents
1. Description
2. Applications
3. EH-MC10 Product numbering
4. Electrical Characteristics
4.1. Recommended Operation Conditions
4.2. Absolute Maximum Rating
4.3. Input/Output Terminal Characteristics
4.4. Power Consumption
5. Pinout and Terminal Description
5.1. Pin Configuration
6. Physical Interfaces
6.1. Power Supply
6.2. PIO
6.3. AIO
6.4. PWM
6.5. UART
6.6. I2C Master
6.7. SPI Master
6.8. SPI Debug
7. Reference Design
8. Layout and Soldering Considerations
8.1. Soldering Recommendations
8.2. Layout Guidelines
9. Mechanical and PCB Footprint Characteristics
10. Reflow Profile
11. Contact Information
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Modu
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Ehong Techno
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Co.
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9.
Mech
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cal a
nd
PCB
Fo
otpr
int C
har
act
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s
Figure
6
：
Physical
Dim
en
sio
ns and
Reco
mm
ended
Fo
otpr
int
(Un
it
:
mm
, D
evi
ation
:0.02m
m)
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