Installation Guide

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moisture conditions. We recommend TEK Max as it
both mitigates moisture issues and creates a non-
porous surface for the adherence of SETAGRIP™.
Please reference TEK Max documents to see
installation instructions and moisture maximums.
SURFACE IRREGULARITIES:
Cracks, grooves,
depressions, control joints, or other non-moving
joints, and other irregularities shall be filled or
smoothed with high-quality Portland cement or
calcium aluminate based patching or underlayment
compound for filling or smoothing, or both. Some
surface cracks may need to be chased and filled.
Patching or underlayment compound shall be
moisture, mildew, and alkali-resistant, and shall
provide a minimum of 3,500 psi compressive
strength after 28 days, when tested in accordance
with Test Method ASTM C109 or ASTM Test
Method C472, whichever is appropriate. Refer to
manufacturer’s instructions of such subfloor
preparation materials for more details.
PATCHING AND SELF-LEVELING:
For concrete
subfloors, use only high- quality Portland cement
calcium aluminate, or synthetic, gypsum-based
materials (minimum 3,500 psi compressive
strength per ASTM C109), and allow to dry
according to manufacturer’s instructions. Self-
leveling compounds may have very high moisture
content, thus requiring longer curing times. Note:
Adding latex to levelers will normally make the
floor NON-POROUS which may eliminate the need
for priming the surface. Follow the manufacturer’s
instructions, and do not over-water patching
and leveling compounds. The installer is
responsible for observing cure times, moisture
content, bonding ability, and the structural
integrity of any leveling or patch compound used.
WARNING
: Do not lightly skim-coat highly polished
or slick, power- troweled concrete surfaces. A thin
film skim coat of floor patch will not bond
sufficiently to a slick subfloor and may become a
bond breaker, causing tiles to release at the
interface of the subfloor and patching material.
Most highly polished or slick, power troweled
concrete surfaces are non-porous and SETAGRIP™
will bond well directly to that surface.
EXPANSION JOINTS / ISOLATION JOINTS:
Such
joints (or other moving joints) are incorporated
into concrete floor slabs in order to permit
movement without causing random cracks in the
concrete. These joints must be honored and not be
filled with underlayment products or other
materials, and floor coverings must not be laid over
them. Expansion joint covering systems should be
detailed by the architect or engineer, and based
upon intended usage and aesthetic considerations.
WOOD SUBFLOORS & UNDERLAYMENTS
All suspended wood subfloors shall have standard,
double-layer construction with a minimum total
thickness of at least 1" (25mm). As a finish layer, use
minimum ¼" (6mm) thick, APA-rated
“underlayment grade” plywood with a fully sanded
face, or other underlayment panel that is
appropriate and warranted for the intended use by
the panel manufacturer. Follow manufacturer’s
instructions for acclimation, installation and surface
preparation. Prime all wood substrates using TEK
Max before installation. All substrates must meet
national and local building code requirements.
● Do not install over wood floors in direct contact
with the earth, concrete slab, over a sleeper floor
assembly.
● The double layer wood subfloor shall incorporate
an APA Underlayment Grade top layer such as
Multi-Ply® or TEKPLY® that is designed for the
intended use meeting the following requirements:
▪ Minimum ¼ inch (5.5 mm) thickness
▪ Sanded face free of knots or roughness to
prevent any surface telegraphing
▪ Solid core free of voids to resist
indentations and punctures from
concentrated loads
▪ Designed for resilient flooring use and free
of any substance that may stain vinyl
▪ Moisture content less than 14.0% and panel
layers within 3.0% of each other
▪ Confirm panel moisture level by checking
in several areas using a calibrated pin
moisture meter
▪ Compliant with APA or manufacturer
recommended as “Underlayment Grade” for
resilient flooring
● Do not install directly over Lauan, pine or other
soft woods, particle board, hardboard, hardwood
flooring, treated wood or underlayment panels
with core voids, face knots or rough surface or any
underlayment that is not recommended by its
manufacturer for the intended use and for use
beneath resilient flooring. Cover these and other
unacceptable wood based surfaces with ¼ inch or
thicker underlayment grade panel in compliance
with all underlayment requirements listed in this
guide.