Installation Guide

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4. Plan, prepare, and protect the substrate moisture
test-sites for the duration of the testing in order to
achieve valid results.
5. Subfloor flatness for all substrates shall not
exceed 3/16 inch in 10 ft. (3.9mm in 3m) and 1/32
inch in 12 inches (0.8 mm in 305 mm).
ACCLIMATION
● Acclimate the SETAGRIP™ flooring, jobsite and
subfloor in the area to be installed to a stable and
consistent temperature between
65°-85°F (18°-29°C) with ambient relative humidity
between 35%-65% RH . The key is to condition the
flooring materials and jobsite environment to
closely match the facilities operational
environmental conditions. Achieve and maintain
the stable and consistent temperature for a
minimum of 24 hours before, during and
continuously after installation. Check the subfloor
surface and flooring materials and confirm all are at
the same temperature (no more than 3°F
difference) before and during the entire
installation.
● Stable acclimation of materials and substrate
usually takes a minimum of 24 hours to accomplish
and may take up to 72 hours or longer, depending
on storage and jobsite environmental conditions.
Check for consistent and stable temperature of the
flooring materials and subfloor surface before and
throughout the installation process.
● Stack plank and tile flooring no more than 5
cartons high. Space all flooring at least 6 inches
apart for acclimation.
● Radiant heated subfloors must be turned off 2
days before installation until 2 days after
installation and temperature maintained with
supplemental heat. Gradually bring the
temperature up 2°F (1°C) per day until reaching
normal operating temperature. Radiant heated
subfloors shall not exceed 85°F (29°C) under any
mode of operation.
● After installation maintain a consistent
operational temperature and RH for optimal
flooring performance. The minimum floor surface
temperature should not go below 60°F (16°C).
SUITABLE SUBFLOORS
SETAGRIP™ flooring products may be installed
over properly prepared, fully bonded and intact
existing hard surface flooring as well as properly
prepared concrete, suspended wood and metal
subfloors. All substrates must be properly prepared
and meeting the requirements listed in this
SETAGRIP™ Installation Instructions, ASTM F710
and ASTM F1482 and have a non-porous surface.
Porous surfaces can be addressed with the use of
Tek-Max, our primer-sealer. Consult with substrate
preparation material supplier for appropriate
material selections, application requirements, and
warranty information. The responsibility of the
assessment, determination, and selection of the
substrate preparation material, along with
application and product performance rests with
the applicator and preparation material provider.
Suitable substrates include:
▪ Concrete (all grades)
▪ Double layer suspended wood
▪ Ceramic tile and Terrazzo
▪ Steel and Aluminum
▪ Single layer, non-cushion sheet vinyl/LVT/VCT
▪ Polymeric Poured Floors
▪ Must#meet applicable building code
requirements
● Proper subfloor testing and preparation is critical
to achieve a beautiful and lasting installation.
● Polymeric, resinous or seamless poured floors
may be installed over, but great care must be taken
in determining substrate suitability. It is difficult to
confirm if they are well bonded to the substrate
and they are prone to moisture related issues
especially when covered with an impervious
surface.
● Existing flooring must have all loose or damaged
areas removed. Floor finish or polish should remain
but be cleaned. Once the damaged areas are
removed and the surface is thoroughly clean,
prepare the surface by leveling and smoothing with
an appropriate patching compound. Glazed,
polished, smooth or dense surfaces should be
checked for surface bonding characteristics, and
may need to be primed if the surface is porous. In
addition, surface preparation materials may require
the use of a primer or bonding agent to
mechanically key to the surface prior to
application.
● Metal Substrates must be completely clean, dry
and free of rust, dirt, wax, marker, paint, grease or
any other deleterious contaminants that may act as
a bond breaker or staining agent. Degrease using
an appropriate heavy-duty degreasing cleaner.
Mineral Spirits may be necessary to remove grease
and/or oil contaminants. Always perform a bond
test prior to installation. Metal substrates are non-
porous and should provide a good bonding
surface. Lead is very soft and will easily dent and
deform. Lead and all soft metal substrates are
recommended to be coated over with a 1/8 inch or
thicker layer of patch or self-leveling underlayment
to stabilize the surface. Follow patch
manufacturers recommendations for proper
application.
● SETAGRIP™ may be installed over existing non-
cushioned single layer resilient flooring only on