CONVERGED PLATFORM

24
APPLICATIONS
HEXAPHI
The best density/computing speed
ratio ever with Xeon® Phi™ DFF
HPC is used for all tasks that require big calculation power,
like forecasting the weather, climate studies, physics
simulations, parallel compute. Grand challenges are
fundamental problems in science and engineering with broad
economic and scientic impact, and whose solution can be
advanced by applying HPC techniques and resources.
When a company looks for petroleum, geological sensors
send astronomical quantities of data, which must be
processed faster than the competition. This is one example of
a critical function of high performance computing (HPC), one
of 2CRSI’s areas of specialization.
This server is designed around an Intel® S2600 TP
motherboard and features 16 memory slots and 2 sockets
for Xeon E5-2600v3/v4 processors for a total of 24 cores.
It includes 6 Intel Xeon Phi 7120D accelerators yielding
366 cores, not including the 2 Intel Xeon CPU, and reaches
a computing power of nearly 9 Tops, with 2000 watts
redundant power supply.
To achieve this, 2CRSI developed internally a PCI Express Gen
3.0 switch board for accessing Xeon Phi accelerators through
a PCI Express switch.
KEY BENEFITS
UP TO 6 XEON® PHI™
Intel® Xeon Phi™ coprocessors provide up to 61 cores,
244 threads per units of performance, and they come
in a variety of congurations to address software,
workload, performance, and eciency requirements.
8.92 teraFLOP PER SECOND
2CRSI designed and developed HEXAPHI HPC solution,
the best density/computing speed ratio ever with
XEON® PHI™ DFF. The solution provides 8.92 teraFLOPS
in a 2U compact form factor.
INTEGRATED PCIe SWITCH
2CRSI uses switch PCIe 3.0 to access the XEON® PHI™
co-processors. 2CRSI developed a special exible
PCIe link cable connector to move data between the
motherboard and the PCIe switches and backplanes.
STORAGE
You can accomodate up to 8x 2.5” internal SSD to reach
up to 3.2 TB. The performance due to SSD drive are
merged with the power of Xeon® Phi™ to enable more
eciency.
INNOVATIVE CO-CPU COOLING
The heat dissipation is ensured by ultra-compact vapoor
chamber copper radiator integrated on the XEON®
PHI™ board.
SERVER