Datasheet

Intel
®
Server Board S5000PAL/S5000XAL TPS Power and Environmental Specifications
Revision 2.0
Intel order number: D31979-011
59
8. Power and Environmental Specifications
8.1 Intel
®
Server Board S5000PAL/S5000XAL Design Specifications
Operation of the server board at conditions beyond those shown in the following table may
cause permanent damage to the system.
Exposure to absolute maximum rating conditions for
extended periods may affect system reliability.
Table 33: Server Board Design Specifications
Operating Temperature 0º C to 55º C
1
(32º F to 131º F)
Non-Operating Temperature -40º C to 70º C (-40º F to 158º F)
DC Voltage ± 5% of all nominal voltages
Shock (Unpackaged) Trapezoidal, 50 g, 170 inches/sec
Shock (Packaged)
< 20 lbs
≥ 20 to < 40
≥ 40 to < 80
≥ 80 to < 100
≥100 to < 120
≥120
36 inches
30 inches
24 inches
18 inches
12 inches
9 inches
Vibration (Unpackaged) 5 Hz to 500 Hz 3.13 g RMS random
Note:
1
Chassis design must provide proper airflow to avoid exceeding the Dual-Core Intel
®
Xeon
®
processor 5000
sequence maximum case temperature.
Disclaimer Note: Intel Corporation server boards support add-in peripherals and contain a
number of high-density VLSI and power delivery components that need adequate airflow to cool.
Intel ensures through its own chassis development and testing that when Intel server building
blocks are used together, the fully integrated system will meet the intended thermal
requirements of these components. It is the responsibility of the system integrator who chooses
not to use Intel developed server building blocks to consult vendor datasheets and operating
parameters to determine the amount of air flow required for their specific application and
environmental conditions. Intel Corporation cannot be held responsible, if components fail or the
server board does not operate correctly when used outside any of their published operating or
non-operating limits.