Integration Guide
Table Of Contents
- Module Integration Guide
- Preface
- About this Guide
- Introduction
- Manufacturing Process
- Hardware Integration Recommendations
- PCB Layout Rules
- Bring-Up and Testing
- Hardware Test Preparation
- Abbreviations
PCB LAYOUT RULES
TRACE CHARACTERISTIC DESIGN
26 PROPRIETARY MODULE INTEGRATION GUIDE
SEQUANS Communications
4.2.5 Grounding
1. Stitch ground areas together with vias where flooded ground remains
unterminated.
2. Stitch ground areas together in general to keep common ground imped-
ance the same across the region.
3. RF ground planes should be as large and continuous as possible and not be
cut into small islands. Check that strings of vias do not inadvertently create
slots in ground or power planes.