Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Auxiliary ADC Specification
- 3.5 Power Supply Dimensioning
- 3.6 I/O Characteristics
- 3.7 Package Description
- 3.8 Packing Information
- 3.9 Storage Conditions
- 3.10 Mounting Considerations
- 3.11 Component Reliability
- 3.12 RF Performance
- Signals and Pins
- Acronyms
SIGNALS AND PINS
SP150Q PINOUT
33 PROPRIETARY SP150Q DATASHEET
SEQUANS Communications
108 VBAT1 In
Table 4-2: Ground Pads
Pad # Pad Name Comment
1
20 22 24 26 28
30 31 32 33 34
42 43 45 46
53 55
62 63 64 65 66 68 69
70 71 72 73 74
86 87
GND All GND pads shall be connected to the same
copper.
T1 T2 T3 T4 T5 T6 T7 T8 T9 T10
T11 T12 T13 T14 T15 T16 T17 T18 T19 T20
T21 T22 T23 T24 T25 T26 T27 T28 T29 T30
GND All GND pads shall be connected to the same
copper.
Table 4-1: Pinout (Continued)
Pad
#
Pad Name
Alternate
Function
Direction
(HW)
Comments