Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Auxiliary ADC Specification
- 3.5 Power Supply Dimensioning
- 3.6 I/O Characteristics
- 3.7 Package Description
- 3.8 Packing Information
- 3.9 Storage Conditions
- 3.10 Mounting Considerations
- 3.11 Component Reliability
- 3.12 RF Performance
- Signals and Pins
- Acronyms
PHYSICAL CHARACTERISTICS
COMPONENT RELIABILITY
25 PROPRIETARY SP150Q DATASHEET
SEQUANS Communications
3.11 Component Reliability
Table 3-12: SP150Q Reliability Figures
Test Item Test Method Test Conditions Test Result
ESD - Direct Discharge
(ANT GND)
IEC 61000-4-2 M.2 board. See detail
inTable 3-13 below.
PASS. See details inTable
3-14 and Table 3-15
below.
ESD Direct Discharge HBM MIL-STD-883J / Method
3015.8
±500V to ±2000V with
500V steps
MM ANSI/ESD S5.2-2009 ±50V to ±200V with 50V
steps
CDM JESD22-C101F NCDM Start: ±500V, Stop:
±500V
Half-Sine Shock Test Step1: Module 15pcs,
drop height 30cm, drop
direction 26 drops (all
surfaces, edges and
corners)
Step2: M2 Card 20pcs,
500G, 1.0msec, 6drops
(6 faces, 1drop/face
PASS
Vibration Test Sweep-Sine Vibration
and Random Vibration
PASS
Bump Test Half Sine, 250m/s2, 6ms,
2bumps/s, 1000bumps
per ±axis
PASS
Low Temperature
Storage test
-40°C, 500 hours PASS
High Temperature
Storage test
85°C, 500 hours PASS