Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Auxiliary ADC Specification
- 3.5 Power Supply Dimensioning
- 3.6 I/O Characteristics
- 3.7 Package Description
- 3.8 Packing Information
- 3.9 Storage Conditions
- 3.10 Mounting Considerations
- 3.11 Component Reliability
- 3.12 RF Performance
- Signals and Pins
- Acronyms
PHYSICAL CHARACTERISTICS
MOUNTING CONSIDERATIONS
SP150Q DATASHEET PROPRIETARY 24
SEQUANS Communications
3.10 Mounting Considerations
This section provides reflow information.
Figure 3-5: Reflow Profile
The SP150Q can support up to 3 reflows with 250°C maximum.
Table 3-11: Reflow Parameters
Parameter Setting
Peak package body temperature Will be provided in a future revision of the document.
Liquidous Time
Preheat/Soak
Ramp-up rate
Ramp-down rate