Data Sheet
Table Of Contents
- Datasheet
- Preface
- About this Datasheet
- Product Features
- Regulatory Approval
- Physical Characteristics
- 3.1 ECCN and Part Number
- 3.2 Electrical Operating Conditions
- 3.3 Environmental Operating Conditions
- 3.4 Auxiliary ADC Specification
- 3.5 Power Supply Dimensioning
- 3.6 I/O Characteristics
- 3.7 Package Description
- 3.8 Packing Information
- 3.9 Storage Conditions
- 3.10 Mounting Considerations
- 3.11 Component Reliability
- 3.12 RF Performance
- Signals and Pins
- Acronyms
SP150Q DATASHEET PROPRIETARY i
SEQUANS Communications
Preface
Legal Notices
Copyright ©2018, SEQUANS Communications
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Communications, and those of its licensees may be protected by one or more
pending or issued U.S. or foreign patents.
Sequans’ SP150Q utilizes SMSC’s Inter-Chip Connectivity™ technology. See
www.smsc.com.
Because of continuing developments and improvements in design,
manufacturing, and deployment, material in this document is subject to
change without notification and does not represent any commitment or
obligation on the part of SEQUANS Communications. SEQUANS
Communications shall have no liability for any error or damages resulting
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