Data Sheet

MECHANICAL CHARACTERISTICS
STORAGE AND MOUNTING
34 PROPRIETARY GM02S DATASHEET (PRELIMINARY)
SEQUANS Communications
3.4 Storage and Mounting
The GM02S module is Moisture Level 3 rated as per JEDEC industrial
standard: http://www.ipc.org/TOC/J-STD-033D-TOC.pdf.
The GM02S can support up to 3 reflows with 250°C maximum.
Figure 3-6: Reflow Profile Parameters
Recommended stencil thickness: 0.1mm~0.13mm (prefer 0.1mm). More detail
on PCB land pattern will be proviedd in a future edition of the document.
Table 3-2: Reflow Profile
Profile Feature
Solder Paste Alloy Sn96.5/Ag3.0/Cu0.5 (Lead Free solder paste)
Peak Package Body Temperature 235°C to 245°C
Liquidous Time Temp: over 220°C
Time: 60 seconds ~ 90 seconds
Pre-heat / Soak Temp: 150~200°C
Time: 60 seconds ~ 120 seconds
Ramp-up Rate < 3°C/second
Ramp-down Rate -3°C~0°C/second
Gas Apply Nitrogen gas
O2 ppm less than 1500 ppm