Datasheet

www.seoulsemicon.com
Product Data Sheet
SDWx1F1C – Chip on Board
23
Handling of Silicone Resin for LEDs
(1) During processing, mechanical stress on the surface should be minimized as much as possible.
Sharp objects of all types should not be used to pierce the sealing compound.
(3) Silicone differs from materials conventionally used for the manufacturing of LEDs.
These conditions must be considered during the handling of such devices. Compared to standard
encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As
mentioned previously, the increased sensitivity to dust requires special care during processing.
In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning
solution must be applied to the surface after the soldering of wire.
(4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are
used, it must be
assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not
recommended. Ultrasonic cleaning may cause damage to the LED.
(5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this
product with acid or sulfur material in sealed space.
(6) Avoid leaving fingerprints on silicone resin parts.
(2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs
without a silicone sealant, since the surface can also become scratched.