Product Data Sheet SDWx1F1C – Chip on Board Enable High Flux and Cost Efficient System Z Power Chip on board – ZC series SDWx1F1C (SDW01F1C, SDW81F1C, SDW91F1C) LM-80 MacAdam 3-Step RoHS Product Brief Description Features and Benefits • The ZC series are LED arrays which provide High Flux and High Efficacy. • It is especially designed for easy assembly of lighting fixtures by eliminating reflow soldering process.
Product Data Sheet SDWx1F1C – Chip on Board Table of Contents Index • Product Brief 1 • Product Performance & Characterization Guide 3 • Characteristics Graph 6 • Product Nomenclature (Labeling Information) 14 • Color Bin Structure 15 • Mechanical Dimensions 20 • Packaging Specification 21 • Handling of Silicone Resin for LEDs 23 • Precaution For Use 24 • Company Information 27 2 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Product Performance & Characterization Guide Table 2. Electro Optical Characteristics, Tj=25ºC CCT (K) Part Number [1] Typical Luminous Flux [2], ФV [3] (lm) Typical Forward Voltage, VF [4] (V) CRI [5], Ra Viewing Angle (degrees) 2Θ ½ Typ. 180mA 460mA* 180mA 460mA* Min. Typ. 5600 870 1,931 34.8 38.1 70 120 5000 885 1,960 34.8 38.1 70 120 4500 915 2,013 34.8 38.1 70 120 4000 913 2,008 34.8 38.1 70 120 5600 815 1810 34.
Product Data Sheet SDWx1F1C – Chip on Board Product Performance & Characterization Guide Table 3. Electro Optical Characteristics, Tj=85ºC CCT (K) [1] Typical Luminous Flux [2], ФV [3] (lm) Typical Forward Voltage, VF [4] (V) Typ. 180mA * 180mA * 5600 783 33.3 5000 797 33.3 4500 824 33.3 4000 822 33.3 5600 725 33.3 5000 730 33.3 4500 703 33.3 4000 690 33.3 3500 674 33.3 3000 668 33.3 2700 641 33.3 4000 592 33.3 3500 561 33.3 3000 552 33.3 2700 522 33.
Product Data Sheet SDWx1F1C – Chip on Board Product Performance & Characterization Guide Table 4. Absolute Maximum Characteristics, Tj=25ºC Value Parameter Symbol Unit Min. Typ. Max. Forward Current IF - 0.18 0.46 A Power Dissipation Pd - 6.3 18.4 W Junction Temperature Tj - - 140 ºC Operating Temperature Topr -40 - 85 ºC Surface Temperature TS - - 100 ºC Storage Temperature Tstg -40 - 100 ºC Thermal resistance (J to S) [1] RθJ-S - 1.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 1. Color Spectrum, Tj=25℃, IF=180mA (CRI70) 120 CRI70(5000K) CRI70(4000K) Relative Intensity(%) 100 80 60 40 20 0 400 450 500 550 600 650 700 750 800 Wavelength (nm) Fig 2. Color Spectrum, Tj=25℃, IF=180mA (CRI80) 120 CRI80(5000K) CRI80(4000K) CRI80(3000K) Relative Intensity(%) 100 80 60 40 20 0 400 450 500 550 600 650 700 750 800 Wavelength (nm) 6 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 3. Color Spectrum, Tj=25℃, IF=180mA (CRI90) 120 CRI90(4000K) CRI90(2700K) Relative Intensity(%) 100 80 60 40 20 0 400 450 500 550 600 650 700 750 800 Wavelength (nm) 7 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 4. Radiant pattern, Tj=25℃, IF=180mA Relative Intensity (%) 100 75 50 25 0 -100 -75 -50 -25 0 25 50 75 100 Angle (Degrees) 8 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 5. Forward Voltage vs. Forward Current, Tj=25℃ 0.5 Foward Current (A) 0.4 0.3 0.2 0.1 0.0 25 30 35 40 Foward Voltage (V) Fig 6. Forward Current vs. Relative Luminous Flux, T j=25℃ Relative Luminous Flux (%) 250 200 150 100 50 0 0.0 0.1 0.2 0.3 0.4 0.5 Foward Current (A) 9 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 7. Junction Temperature vs. Relative Light Output, IF=180mA Relative luminous flux (%) 120 100 80 60 40 20 0 25 50 75 100 125 150 o Junction Temperature ( C) Fig 8. Junction Temperature vs. Forward Voltage, IF=180mA 0.5 Foward Voltage (V) 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 25 50 75 100 125 150 o Junction Temperature( C) 10 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 9. Junction Temperature vs. CIE X, Y Shift, IF=180mA (CRI70) 0.03 CIE X(5000K) CIE Y(5000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Jinction Temperature( C) Fig 10. Junction Temperature vs. CIE X, Y Shift, IF=180mA (CRI90) 0.03 CIE X(3000K) CIE Y(3000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Junction Temperature( C) 11 www.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 11. Junction Temperature vs. CIE X, Y Shift, IF=180mA (CRI80) 0.03 CIE X(5000K) CIE Y(5000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Junction Temperature ( C) 0.03 CIE X(3000K) CIE Y(3000K) Relative Variation 0.02 0.01 0.00 -0.01 -0.02 -0.03 20 40 60 80 100 120 140 o Junction Temperature ( C) 12 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Characteristics Graph Fig 12. Surface Temperature vs. Maximum Forward Current, Tj(max.)=140℃ Maximum Current (A) 0.6 0.4 0.2 0.0 20 40 60 80 100 120 o Surface Temperature ( C) 13 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Product Nomenclature Table 5. Part Numbering System : X1X2X3 X4X5 X6X7 X8 Part Number Code Description Part Number Value X1 Company S X2 Package series D X3X4 Color Specification W0 CRI 70 W8 CRI 80 W9 CRI 90 X5 Series number 1 X6 Lens type F Flat X7 PCB type 1 PCB X8 Revision number C New COB type Table 6.
Product Data Sheet SDWx1F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram 0.42 Y 0.39 0.36 0.33 0.33 0.36 0.39 0.42 0.45 0.48 X 15 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, Tj=25℃, IF=180mA 0.38 4700K 5000K C1 5300K C0 0.36 5600K B1 C2 B0 B3 C4 B2 B5 Y 6000K 0.34 C3 C5 B4 0.32 0.32 0.34 0.36 X B0 B1 B2 CIE x CIE y CIE x CIE y CIE x CIE y 0.3207 0.3462 0.3292 0.3539 0.3212 0.3389 0.3212 0.3389 0.3293 0.3461 0.3217 0.3316 0.3293 0.3461 0.3373 0.3534 0.3293 0.3384 0.3292 0.3539 0.3376 0.3616 0.3293 0.
Product Data Sheet SDWx1F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, Tj=25℃, IF=180mA 3700K 0.40 4000K E22 4200K E21 E11 4500K 0.38 Y E10 D22 4700K E24 D21 D11 E23 D10 0.36 D24 D23 0.34 0.34 ANSI MacAdam 3-STEP MacAdam 4-STEP 0.36 0.38 0.40 X 3-STEP 4-STEP D10 E10 D11 E11 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.3589 0.3685 0.3764 0.3713 0.3560 0.3557 0.3746 0.3689 0.3665 0.3742 0.3793 0.3828 0.3580 0.3697 0.3784 0.3841 0.3637 0.
Product Data Sheet SDWx1F1C – Chip on Board Color Bin Structure CIE Chromaticity Diagram, Tj=25℃, IF=180mA 0.44 3000K 0.42 3500K 0.40 H10 G11 G10 F21 F11 F10 H22 H11 G22 G21 F22 3700K Y H21 2100K 2600K 2700K 2900K G24 G23 H24 H23 F24 0.38 F23 ANSI MacAdam 3-STEP MacAdam 4-STEP 0.36 0.38 0.40 0.42 0.44 0.46 0.48 X 3-STEP F10 4-STEP G10 H10 F11 G11 H11 CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y CIE x CIE y 0.4006 0.3829 0.4267 0.3946 0.
Product Data Sheet SDWx1F1C – Chip on Board Color Bin Structure Table 7. Bin Code description Luminous Flux (lm) @ IF = 180mA Part Number SDW01F1C SDW81F1C SDW91F1C Bin Code Min. Max. C 700 800 Color Chromaticity Coordinate @ IF = 180mA Typical Forward Voltage (Vf) @ IF = 180mA Bin Code Min. Max. D 32.0 34.0 E 34.0 38.0 Refer to page.15~17 D 800 900 E 900 1100 F 38.0 40.0 B2 635 700 D 32.0 34.0 C 700 800 E 34.0 38.0 D 800 900 F 38.0 40.
Product Data Sheet SDWx1F1C – Chip on Board Mechanical Dimensions Circuit Cathode X 12 S1 Ts X 12 Anode Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.2mm 20 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Packaging Specification Notes : (1) Quantity : 30pcs/Tray (2) All dimensions are in millimeters (tolerance : ±0.3) (3) Scale none 21 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Packaging Specification Notes : (1) Heat Sealed after packing (Use Zipper Bag) (2) Quantity : 3Tray(90pcs) /Bag 22 www.seoulsemicon.
Product Data Sheet SDWx1F1C – Chip on Board Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.
Product Data Sheet SDWx1F1C – Chip on Board Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b.
Product Data Sheet SDWx1F1C – Chip on Board Precaution for Use (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
Product Data Sheet SDWx1F1C – Chip on Board Precaution for Use Ⅱ. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device.
Product Data Sheet SDWx1F1C – Chip on Board Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets.
