Datasheet

www.seoulsemicon.com
Product Data Sheet
 “제품 명 – 제품 군” 을 기입하십시오.
제품 군은 홈페이지 응용분야 분류기준을 참고한다.
(예) SZ5M0WWC9 – High-power LED
30
Font 글씨체
표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt
 Revision numbering 기준:
• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0
 수정일자 표기형식; YYYY-MM-DD
(예) 2013-04-01
MJT 5630-Acrich MJT
Precaution for Use
(17) Similar to most Solid state devices;
LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS).
Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects.
a. ESD (Electro Static Discharge)
Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects
come into contact. While most ESD events are considered harmless, it can be an expensive
problem in many industrial environments during production and storage. The damage from ESD
to an LEDs may cause the product to demonstrate unusual characteristics such as:
 Increase in reverse leakage current
 Lowered turn-on voltage
 Abnormal emissions from the LED at low current
The following Recommendations are suggested to help minimize the potential for an ESD event:
 One or more recommended work area suggestions:
- Ionizing fan setup
- ESD table/shelf mat made of conductive materials
- ESD safe storage containers
 One or more personnel suggestion options:
- Antistatic Wrist-strap
- Antistatic material shoes
- Antistatic clothes
 Environmental controls
- Humidity control (ESD gets worse in a dry environment)
b. EOS (Electrical Over Stress)
Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is
subjected to a current or voltage that is beyond the maximum specification limits of the device.
The effects from an EOS event can be noticed through product performance like:
 Changes to the performance of the LED package (If the damage is around the bond pad area and
since the package is completely encapsulated the package may turn on but flicker show severe
performance degradation.)
 Changes to the light output of the luminaire from component failure
 Components on the board not operating at determined drive power
 Failure of performance from entire fixture due to changes in circuit voltage and current across
total circuit causing trickle down failures
It is impossible to predict the failure mode of every LED exposed to electrical overstress as the
failure modes have been investigated to vary, but there are some common signs that will indicate
an EOS event has occurred.
 Damaged may be noticed to the bond wires (appearing similar to a blown fuse)
 Damage to the bond pads located on the emission surface of the LED package (shadowing can
be noticed around the bond pads while viewing through a microscope)
 Anomalies noticed in the encapsulation and phosphor around the bond wires.
- This damage usually appears due to the thermal stress produced during the EOS event.
To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing:
 A surge protection circuit
- An appropriately rated over voltage protection device
- A current limiting device