Datasheet

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Product Data Sheet
 “제품 명 – 제품 군” 을 기입하십시오.
제품 군은 홈페이지 응용분야 분류기준을 참고한다.
(예) SZ5M0WWC9 – High-power LED
27
Font 글씨체
표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt
 Revision numbering 기준:
• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0
 수정일자 표기형식; YYYY-MM-DD
(예) 2013-04-01
MJT 5630-Acrich MJT
Reflow Soldering Characteristics
Table 8.
Caution
(1) Reflow soldering is recommended not to be done more than two times. In the case of more than
24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
IPC/JEDEC J-STD-020
Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max.
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (Tsmin to Tsmax) (ts)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (Tp)
215℃ 260℃
Time within 5°C of actual Peak
Temperature (tp)2
10-30 seconds 20-40 seconds
Ramp-down Rate 6 °C/second max. 6 °C/second max.
Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.