Datasheet

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Product Data Sheet
SAW0LH0A– Acrich MJT 5050
18
Reflow Soldering Characteristics
Table 5.
Caution
(1) Reflow soldering is recommended not to be done more than two times.
In the case of more than 24 hours passed soldering after first, LEDs will be damaged.
(2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable,
suitable tools must be used.
(3) Die slug is to be soldered.
(4) When soldering, do not put stress on the LEDs during heating.
(5) After soldering, do not warp the circuit board.
IPC/JEDEC J-STD-020
Profile Feature
Sn-Pb Eutectic Assembly Pb-Free Assembly
Average ramp-up rate (T
smax
to T
p
) 3° C/second max. 3° C/second max.
Preheat
- Temperature Min (T
smin
)
- Temperature Max (T
smax
)
- Time (T
smin
to T
smax
)
100 °C
150 °C
60-120 seconds
150 °C
200 °C
60-180 seconds
Time maintained above:
- Temperature (T
L
)
- Time (t
L
)
183 °C
60-150 seconds
217 °C
60-150 seconds
Peak Temperature (T
p
)
215℃ 260℃
Time(t
p
) within 5°C of actual Peak
Temperature
10-30 seconds 20-40 seconds
Ramp-down Rate
6 °C/second max. 6 °C/second max.
Time 25°C to Peak Temperature
6 minutes max. 8 minutes max.