User's Manual

© SENSITECH INC. CONFIDENTIAL – CONTROLLED DOCUMENT
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PART NUMBER T82002163
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frequency-change modes
• Provides signals and controls for fly-by DMA transfers
• Supports non-volatile memory configured as bank 0 from either 16- or 32-bit devices
• Provides three independent output clocks (SDCLK<2:0>) that can be turned on/off separately
and can be programmed to be free-running. The clocks can be the same frequency or half the
frequency of the input clock, CLK_MEM. One clock (SDCLK<0>) can also be programmed
as one quarter of the input-clock frequency. A fourth output clock (SDCLK<3>) depends on
configuration bits used to control SDCLK<0>.
• Provides a programmable power-down mode for saving power
Memory Controller Operation
The processor has three different memory spaces: SDRAM, static memory, and PC Card space.
SDRAM has four partitions, static memory has six partitions, and PC Card space has two partitions
(or sockets). When user software performs a memory burst across the boundary between any two
adjacent partitions, the configurations for each partition must be identical. They must have the
same external bus width, burst length, and so forth.
In theory, the partitions can be different types of memory sharing the same configuration
characteristics. In practice, cross-partition memory bursts are conducted only when the two
partitions hold the same memory type. A typical case is a transfer across two SDRAM partitions, 0
and 1, which are mandated to have the same characteristics.
Figure 6-1 is a block diagram of the maximum configuration of the memory controller.
Stacked SDRAM and Flash Memory
This section describes memory types that may be supported in the PXA271 and PXA272
processors.
Stacked SDRAM
On the Intel® PXA271 processor, SDRAM is stacked and connected to SDRAM partition 0. On
systems using the Intel® PXA271 processor, external SDRAM memory chips must not exist within
the same SDRAM partition pair as that of the internal stacked SDRAM. This could cause negative
signal reflection to the stacked SDRAM device.
For the Intel® PXA271 processor stacked SDRAM, the Intel® PXA27x processor memory
controller must be programmed to multiplex the SDRAM address lines out differently because the
address lines to the stacked SDRAM are not connected to the usual MA<24:10> lines. The
MDCNFG[STACKx] field on a Intel® PXA271 processor must be programmed to 0b01 to send the
SDRAM address out on MA<24:23,13:1> for stacked 16-bit SDRAM of this product.
For a non stacked part (Intel® PXA270 processor) or flash only stacked part (Intel® PXA272
processor) the MDCNFG[STACKx] field must be programmed to 0b00 to send the SDRAM
address out on MA<24:10>.
Stacked Flash Memory
A fourth SDCLK, SDCLK<3> is driven by the memory controller, to be used in the PXA271 and
PXA272 processors containing stacked flash devices. SDCLK<3> is a buffer duplicate of