Data Sheet

Packaging and labeling VL53L0X
34/40 DocID029104 Rev 2
8.3.1 Tape outline drawings
Figure 27. Tape outline drawing
8.4 Pb-free solder reflow process
Figure 28 and Table 15 shows the recommended and maximum values for the solder
profile.
Customers will have to tune the reflow profile depending on the PCB, solder paste and
material used.
We expect customers to follow the “recommended” reflow profile, which is specifically tuned
for VL53L0X package.
For any reason if a customer must perform a reflow profile which is different from
“recommended” one (especially peak >240°C), this new profile must be qualified by the
customer at its own risk. In any case, the profile have to be within the “maximum” profile limit
described in
Table 15.
Pin 1