Data Sheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMV324IDR SOIC D 14 2500 364.0 364.0 27.0
LMV324IDR SOIC D 14 2500 367.0 367.0 38.0
LMV324IDR SOIC D 14 2500 333.2 345.9 28.6
LMV324IDRG4 SOIC D 14 2500 333.2 345.9 28.6
LMV324IPWR TSSOP PW 14 2000 364.0 364.0 27.0
LMV324IPWR TSSOP PW 14 2000 367.0 367.0 35.0
LMV324IPWRG4 TSSOP PW 14 2000 367.0 367.0 35.0
LMV324QDR SOIC D 14 2500 367.0 367.0 38.0
LMV324QPWR TSSOP PW 14 2000 367.0 367.0 35.0
LMV358IDDUR VSSOP DDU 8 3000 202.0 201.0 28.0
LMV358IDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LMV358IDR SOIC D 8 2500 367.0 367.0 35.0
LMV358IDR SOIC D 8 2500 340.5 338.1 20.6
LMV358IDR SOIC D 8 2500 364.0 364.0 27.0
LMV358IDRG4 SOIC D 8 2500 340.5 338.1 20.6
LMV358IPWR TSSOP PW 8 2000 367.0 367.0 35.0
LMV358IPWR TSSOP PW 8 2000 364.0 364.0 27.0
LMV358QDDUR VSSOP DDU 8 3000 202.0 201.0 28.0
LMV358QDGKR VSSOP DGK 8 2500 358.0 335.0 35.0
LMV358QDR SOIC D 8 2500 340.5 338.1 20.6
LMV358QPWR TSSOP PW 8 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Aug-2015
Pack Materials-Page 3