Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Introduction
- 2 Description
- 3 Functional overview
- 3.1 Architecture
- 3.2 Arm Cortex-M4 core
- 3.3 Adaptive real-time memory accelerator (ART Accelerator)
- 3.4 Memory protection unit (MPU)
- 3.5 Memories
- 3.6 Security memory management
- 3.7 Boot modes
- 3.8 Sub-GHz radio
- 3.9 Power supply management
- 3.10 Low-power modes
- 3.11 Peripheral interconnect matrix
- 3.12 Reset and clock controller (RCC)
- 3.13 General-purpose inputs/outputs (GPIOs)
- 3.14 Directly memory access controller (DMA)
- 3.15 Interrupts and events
- 3.16 Analog-to-digital converter (ADC)
- 3.17 Voltage reference buffer (VREFBUF)
- 3.18 Digital-to-analog converter (DAC)
- 3.19 Comparator (COMP)
- 3.20 True random number generator (RNG)
- 3.21 Advanced encryption standard hardware accelerator (AES)
- 3.22 Public key accelerator (PKA)
- 3.23 Timer and watchdog
- 3.24 Real-time clock (RTC), tamper and backup registers
- 3.25 Inter-integrated circuit interface (I2C)
- 3.26 Universal synchronous/asynchronous receiver transmitter (USART/UART)
- 3.27 Low-power universal asynchronous receiver transmitter (LPUART)
- 3.28 Serial peripheral interface (SPI)/integrated-interchip sound interface (I2S)
- 3.29 Development support
- 4 Pinouts, pin description and alternate functions
- 5 Electrical characteristics
- 5.1 Parameter conditions
- 5.2 Absolute maximum ratings
- 5.3 Operating conditions
- 5.3.1 Main performances
- 5.3.2 General operating conditions
- 5.3.3 Sub-GHz radio characteristics
- Table 26. Sub-GHz radio power consumption
- Table 27. Sub-GHz radio power consumption in transmit mode (SMPS ON)
- Table 28. Sub-GHz radio general specifications
- Table 29. Sub-GHz radio receive mode specifications
- Table 30. Sub-GHz radio transmit mode specifications
- Table 31. Sub-GHz radio power management specifications
- 5.3.4 Operating conditions at power-up/power-down
- 5.3.5 Embedded reset and power-control block characteristics
- 5.3.6 Embedded voltage reference
- 5.3.7 Supply current characteristics
- Typical and maximum current consumption
- Table 35. Current consumption in Run and LPRun modes, CoreMark code with data running from Flash memory, ART enable (cache ON, prefetch OFF)
- Table 36. Current consumption in Run and LPRun modes, CoreMark code with data running from SRAM1
- Table 37. Typical current consumption in Run and LPRun modes, with different codes running from Flash memory, ART enable (cache ON, prefetch OFF)
- Table 38. Typical current consumption in Run and LPRun modes, with different codes running from SRAM1
- Table 39. Current consumption in Sleep and LPSleep modes, Flash memory ON
- Table 40. Current consumption in LPSleep mode, Flash memory in power-down
- Table 41. Current consumption in Stop 2 mode
- Table 42. Current consumption in Stop 1 mode
- Table 43. Current consumption in Stop 0 mode
- Table 44. Current consumption in Standby mode
- Table 45. Current consumption in Shutdown mode
- Table 46. Current consumption in VBAT mode
- Table 47. Current under Reset condition
- I/O system current consumption
- On-chip peripheral current consumption
- Typical and maximum current consumption
- 5.3.8 Wakeup time from low-power modes and voltage scaling transition times
- 5.3.9 External clock source characteristics
- 5.3.10 Internal clock source characteristics
- 5.3.11 PLL characteristics
- 5.3.12 Flash memory characteristics
- 5.3.13 EMC characteristics
- 5.3.14 Electrical sensitivity characteristics
- 5.3.15 I/O current injection characteristics
- 5.3.16 I/O port characteristics
- 5.3.17 NRST pin characteristics
- 5.3.18 Analog switches booster
- 5.3.19 Analog-to-digital converter characteristics
- 5.3.20 Temperature sensor characteristics
- 5.3.21 VBAT monitoring characteristics
- 5.3.22 Voltage reference buffer characteristics
- 5.3.23 Digital-to-analog converter characteristics
- 5.3.24 Comparator characteristics
- 5.3.25 Timers characteristics
- 5.3.26 Communication interfaces characteristics
- 6 Package information
- 6.1 UFBGA73 package information
- Figure 26. UFBGA - 73 balls, 5 × 5 mm, ultra thin fine pitch ball grid array package outline
- Table 90. UFBGA - 73 balls, 5 × 5 mm, ultra thin fine pitch ball grid array mechanical data
- Figure 27. UFBGA - 73 balls, 5 × 5 mm, ultra thin fine pitch ball grid array recommended footprint
- Table 91. UFBGA recommended PCB design rules (0.5 mm pitch BGA)
- Device marking for UFBGA73
- 6.2 Package thermal characteristics
- 6.1 UFBGA73 package information
- 7 Ordering information
- 8 Revision history
DS13105 Rev 4 67/135
STM32WLE5J8/JB/JC Electrical characteristics
127
BI_L Blocking immunity, LoRa
Offset = ±1 MHz, BW = 125 kHz,
SF = 12
-87 -
dB
Offset = ±2 MHz, BW = 125 kHz,
SF = 12
-91 -
Offset = ±10 MHz, BW = 125 kHz,
SF = 12
-96 -
IIP3 Third order input intercept point
Unwanted tones are 1 MHz and
1.96 MHz above LO.
868 to 915 MHz band
-–9 -
dBm
Unwanted tones are 1 MHz and
1.96 MHz above LO.
433 MHz band
- –15 -
IMA Image attenuation
Without IQ calibration - 30 -
dB
With IQ calibration - 54 -
BW_F DSB channel filter BW, FSK Programmable, typical values 4.8 - 467 kHz
TS_RX Receiver wakeup time FS to RWX - 41 - µs
FERR_L
Maximum tolerated frequency
offset between transmitter and
receiver, SF7 to SF12
All bandwidths, ±25 % of BW.
The tighter limit between this line
and the three lines below applies.
-±25 - BW
Maximum tolerated frequency
offset between transmitter and
receiver, SF10 to SF12
SF12 –50 - 50
ppmSF11 –100 - 100
SF10 –200 - 200
Table 29. Sub-GHz radio receive mode specifications (continued)
Symbol Description Conditions Min Typ Max Unit
Table 30. Sub-GHz radio transmit mode specifications
Symbol Description Conditions Min Typ Max Unit
TXOP Max RF output power
Highest power step setting
for low-power PA (LP PA)
-+15
(1)
-
dBm
Highest power step setting
for high-power PA (HP PA)
-+22-
TXDRP
RF output power drop
versus supply voltage
LP PA, under SMPS or LDO
VDDop range from 1.8 to 3.7 V
-0.5-
dB
HP PA, +22 dBm, V
DD
= 2.7 V - 2 -
HP PA, +22 dBm, V
DD
= 2.4 V - 3 -
HP PA, +22 dBm, V
DD
= 1.8 V - 6 -
TXPRNG RF output power range
Programmable in 31 steps,
typical value
TXOP-31 - TXOP dBm
TXACC
RF output power step
accuracy
--±2-dB