Datasheet
Table Of Contents
- Table 1. Device summary
- 1 Introduction
- 2 Description
- 3 Functional overview
- 3.1 Architecture
- 3.2 Arm Cortex-M4 core
- 3.3 Adaptive real-time memory accelerator (ART Accelerator)
- 3.4 Memory protection unit (MPU)
- 3.5 Memories
- 3.6 Security memory management
- 3.7 Boot modes
- 3.8 Sub-GHz radio
- 3.9 Power supply management
- 3.10 Low-power modes
- 3.11 Peripheral interconnect matrix
- 3.12 Reset and clock controller (RCC)
- 3.13 General-purpose inputs/outputs (GPIOs)
- 3.14 Directly memory access controller (DMA)
- 3.15 Interrupts and events
- 3.16 Analog-to-digital converter (ADC)
- 3.17 Voltage reference buffer (VREFBUF)
- 3.18 Digital-to-analog converter (DAC)
- 3.19 Comparator (COMP)
- 3.20 True random number generator (RNG)
- 3.21 Advanced encryption standard hardware accelerator (AES)
- 3.22 Public key accelerator (PKA)
- 3.23 Timer and watchdog
- 3.24 Real-time clock (RTC), tamper and backup registers
- 3.25 Inter-integrated circuit interface (I2C)
- 3.26 Universal synchronous/asynchronous receiver transmitter (USART/UART)
- 3.27 Low-power universal asynchronous receiver transmitter (LPUART)
- 3.28 Serial peripheral interface (SPI)/integrated-interchip sound interface (I2S)
- 3.29 Development support
- 4 Pinouts, pin description and alternate functions
- 5 Electrical characteristics
- 5.1 Parameter conditions
- 5.2 Absolute maximum ratings
- 5.3 Operating conditions
- 5.3.1 Main performances
- 5.3.2 General operating conditions
- 5.3.3 Sub-GHz radio characteristics
- Table 26. Sub-GHz radio power consumption
- Table 27. Sub-GHz radio power consumption in transmit mode (SMPS ON)
- Table 28. Sub-GHz radio general specifications
- Table 29. Sub-GHz radio receive mode specifications
- Table 30. Sub-GHz radio transmit mode specifications
- Table 31. Sub-GHz radio power management specifications
- 5.3.4 Operating conditions at power-up/power-down
- 5.3.5 Embedded reset and power-control block characteristics
- 5.3.6 Embedded voltage reference
- 5.3.7 Supply current characteristics
- Typical and maximum current consumption
- Table 35. Current consumption in Run and LPRun modes, CoreMark code with data running from Flash memory, ART enable (cache ON, prefetch OFF)
- Table 36. Current consumption in Run and LPRun modes, CoreMark code with data running from SRAM1
- Table 37. Typical current consumption in Run and LPRun modes, with different codes running from Flash memory, ART enable (cache ON, prefetch OFF)
- Table 38. Typical current consumption in Run and LPRun modes, with different codes running from SRAM1
- Table 39. Current consumption in Sleep and LPSleep modes, Flash memory ON
- Table 40. Current consumption in LPSleep mode, Flash memory in power-down
- Table 41. Current consumption in Stop 2 mode
- Table 42. Current consumption in Stop 1 mode
- Table 43. Current consumption in Stop 0 mode
- Table 44. Current consumption in Standby mode
- Table 45. Current consumption in Shutdown mode
- Table 46. Current consumption in VBAT mode
- Table 47. Current under Reset condition
- I/O system current consumption
- On-chip peripheral current consumption
- Typical and maximum current consumption
- 5.3.8 Wakeup time from low-power modes and voltage scaling transition times
- 5.3.9 External clock source characteristics
- 5.3.10 Internal clock source characteristics
- 5.3.11 PLL characteristics
- 5.3.12 Flash memory characteristics
- 5.3.13 EMC characteristics
- 5.3.14 Electrical sensitivity characteristics
- 5.3.15 I/O current injection characteristics
- 5.3.16 I/O port characteristics
- 5.3.17 NRST pin characteristics
- 5.3.18 Analog switches booster
- 5.3.19 Analog-to-digital converter characteristics
- 5.3.20 Temperature sensor characteristics
- 5.3.21 VBAT monitoring characteristics
- 5.3.22 Voltage reference buffer characteristics
- 5.3.23 Digital-to-analog converter characteristics
- 5.3.24 Comparator characteristics
- 5.3.25 Timers characteristics
- 5.3.26 Communication interfaces characteristics
- 6 Package information
- 6.1 UFBGA73 package information
- Figure 26. UFBGA - 73 balls, 5 × 5 mm, ultra thin fine pitch ball grid array package outline
- Table 90. UFBGA - 73 balls, 5 × 5 mm, ultra thin fine pitch ball grid array mechanical data
- Figure 27. UFBGA - 73 balls, 5 × 5 mm, ultra thin fine pitch ball grid array recommended footprint
- Table 91. UFBGA recommended PCB design rules (0.5 mm pitch BGA)
- Device marking for UFBGA73
- 6.2 Package thermal characteristics
- 6.1 UFBGA73 package information
- 7 Ordering information
- 8 Revision history
DS13105 Rev 4 25/135
STM32WLE5J8/JB/JC Functional overview
46
The SMPS needs a clock to be functional. If for any reason this clock stops, the device may
be destroyed. To avoid this situation, a clock detection is used to, in case of a clock failure,
switch off the SMPS and enable the LDO. The SMPS clock detection is enabled by the sub-
GHz radio SUBGHZ_SMPSC0R.CLKDE. By default, the SMPS clock detection is disabled
and must be enabled before enabling the SMPS.
Danger: Before enabling the SMPS, the SMPS clock detection must be
enabled in the sub-GHz radio SUBGHZ_SMPSC0R.CLKDE.
3.9.2 Power supply supervisor
The devices integrate a power-on reset/power-down reset, coupled with a Brownout reset
(BOR) circuitry.
BOR0 level cannot be disabled. Other BOR levels can be enabled by user option. When
enabled, BOR is active in all power modes except in Shutdown
Five BOR thresholds can be selected through option bytes.
During power-on, BOR keeps the device under reset until the supply voltage V
DD
reaches
the specified V
BORx
threshold:
• When V
DD
drops below the selected threshold, a device reset is generated.
• When V
DD
is above the V
BORx
upper limit, the device reset is released and the system
can start.
The devices feature an embedded PVD (programmable voltage detector) that monitors the
V
DD
power supply and compares it with the V
PVD
threshold. An interrupt can be generated
when V
DD
drops below the V
PVD
threshold and/or when V
DD
is higher than the V
PVD
threshold. The interrupt service routine can then generate a warning message and/or put
the MCU into a safe state.
The PVD is enabled by software and can be configured to monitor the V
DD
supply level
needed for the sub-GHz radio operation. For this, the PVD must select its lowest threshold,
and the PVD and the wakeup must be enabled by the EWPVD bit in PWR_CR3 register.
Only a voltage drop below the PVD level generates a wakeup event.
In addition, the devices embed a PVM (peripheral voltage monitor) that compares the
independent supply voltage V
DDA
with a fixed threshold to ensure that the peripheral is in its
functional supply range.
Finally, a radio end-of-life monitor provides information on the V
DD
supply when V
DD
is too
low to operate the sub-GHz radio. When reaching the EOL level, the software must stop all
radio activity in a safe way.
3.9.3 Linear voltage regulator
Two embedded linear voltage regulators supply all the digital circuitries, except for the
Standby circuitry and the Backup domain. The main regulator (MR) output voltage (VCORE)
can be programmed by software to two different power ranges (range 1 and range 2), to
optimize the consumption depending on the system maximum operating frequency.