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EMB1061 BLE Module
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Table Of Contents
Abstract
Version history
1. Product Introduction
1.1 EMB1061 appearance
1.2 Pin Arrangement
1.3 Pin Definition
1.3.1 EMB1061 Package Definition
1.3.2 EMB1061 Pin Definition
2. Electrical Parameters
2.1 Operating Conditions
2.2 Power Consumption
2.3 Working Environment
2.4 Electrostatic Discharge
3. RF parameters
3.1 Basic RF parameters
3.2 FSK/GFSK Parameters
4. Antenna Information
4.1 Antenna Type
4.2 PCB Antenna Clearance Zone
4.3 External Antenna Connector
5. Assembly Information and Production Guidance
5.1 Assembly Size
5.2 Production Guidance（Important）
5.3 Considerations
5.4 Storage Condition
5.5 Temperature Curve of Secondary Reflow
6. Reference Circuit
7. Module MOQ and Package Information
8. Sales Information and Technical Support
Datasheet
[Page
19]
EMB1061
T
emperature C
urve of Sec
o
ndar
y
Reflo
w
Suggested
solder
paste
ty
pe:
SAC305,
unleaded,
solder
paste
thickness
from
0.12
to
0.15,
less
than
2
times
reflow
.
Figure 10
T
em
perature Curve of Secondar
y Ref
low
1
...
...
18
19
20
21
22
23
...
24
