Datasheet

Datasheet [Page 15]
EMB1061
5. Assembly Information and Production Guidance
Assembly Size
Figure 7 EWB1061 mechanical size (Unit: mm)
Production Guidance（Important）
⚫ The stamp hole package module produced by Mxchip must completely being patched by SMT machine
in 24 hours after open firmware package. Otherwise the module should be re-package by vacuum pumping
and drying before patch.
▪ Devices for SMT patch:
（1）Reflow soldering machine
（2）AOI detector
（3）Suction nozzle with 6-8mm caliber
▪ Device for drying:
（1）Cabinet type oven