reComputer Jetson-20-1 Introduction reComputer Jetson-20-1 series are compact edge computers built with NVIDIA advanced AI embedded system Jetson XavierNX and Seeed reference carrier board v1. With rich extension modules, industrial peripherals, thermal management combined with decades of Seeed’s hard-ware expertise, reComputer Jetson is ready to help you accelerate and scale the next-gen AI product emerging diverse AI scenarios.
Category Introduction Part list 1 2 Module - Jetson Xavier (production version) Xavier Performance. Nano Size Powerful 21 Tops AI Performance Incredible Power Efficiency Module Technical Specifications 3 3 3 3 4 Seeed reference Carrier Board v1 USB Ports HDMI and DisplayPort M.2 Key E Expansion Slot M.
Module - Jetson Xavier (production version) Xavier Performance. Nano Size At 70mm x 45mm, Jetson Xavier NX packs the power of the NVIDIA Xavier SoC into a module the size of a JetsonNano™. This compact module combines exceptional performance and power advantage with a rich set of IOs - from high-speed CSI and PCIe to low-speed I2Cs and GPIOs. Take advantage of the small form factor, sensor-rich interfaces, and big performance to bring new capability to all your embedded AI and edge systems.
Module Technical Specifications Jetson Xavier NX Jetson Xavier NX 16GB AI Performance 21 TOPS GPU 384-core NVIDIA Volta™ GPU with 48 Tensor Cores CPU 6-core NVIDIA Carmel ARM®v8.2 64-bit CPU 6MB L2 + 4MB L3 Memory 8 GB 128-bit LPDDR4x 59.7GB/s Storage 16 GB eMMC 5.1 Power 10 W | 15 W | 20 W PCIe 1 x1 (PCIe Gen3) + 1 x4 (PCIe Gen4), total 144 GT/s* CSI Camera Up to 6 cameras (24 via virtual channels); 14 lanes (3x4 or 6x2) MIPI CSI-2; D-PHY 1.
Seeed reference Carrier Board v1 The Seeed reference carrier board provides several connectors with industry standard pin outs to support additional functionality beyond what is integrated on the main platform board. This includes: USB 2.0: Micro B Connector USB 3.0: 4 x Type A Connectors Gigabit Ethernet: RJ45 Connector HDMI / DP: HDMI Type A and DisplayPort Stacked Connector M.2 Key E Socket M.
USB Port The carrier board supports two USB Connectors. One is a USB 2.0 Micro B connector supporting Device mode only (including USB Recovery). There are two, dual stacked USB 3.0 Type A connectors. Each connector supports Host mode only. A single load switch supplies VBUS to all four USB 3.0 ports and is limited to 2A of output current. USB 2.
USB 3.0 Type A Connector Pin Descriptions: Pin # Module Pin Nam Module Pin 1 # USB 3.0eType A (2) Usage/Description Type/Dir 1 – – VBUS Supply Power 2 USB1_D_N 115 3 USB1_D_P 117 USB 2.0 #2 Data from hub Bidir 4 – – Ground Ground 5 USBSS_RX_N 161 6 USBSS_RX_P 163 USB 3.0 Receive #2 Data from hub Input 7 – – Ground Ground 8 USBSS_TX_N 166 9 USBSS_TX_P 168 2 USB 3.0 Transmit #2 Data from hub Output USB 3.
USB 3.0 Type A Connector Pin Descriptions: Pin # Module Pin Name1 Module Pin # Usage/Description Type/Dir 2 USB 3.0 Type A (4) 1 – – 2 USB1_D_N 115 3 USB1_D_P 117 4 – – 5 USBSS_RX_N 161 6 USBSS_RX_P 163 7 – – 8 USBSS_TX_N 166 9 USBSS_TX_P 168 VBUS Supply Power USB 2.0 #4 Data from hub Bidir Ground Ground USB 3.0 Receive #4 Data from hub Input Ground Ground USB 3.0 Transmit #4 Data from hub Output USB 3.
Gigabit Ethernet Ethernet RJ45 Connector Pin Description: Pin # Module Pin Name Module Pin # Usage/Description Type/Dir 1 GPE_MDI0_P 186 Gigabit Ethernet MDI 0+ Bidir 2 GPE_MDI0_N 184 Gigabit Ethernet MDI 0– Bidir 3 GPE_MDI1_P 192 Gigabit Ethernet MDI 1+ Bidir 4 – – MCT – 5 – – MCT – 6 GPE_MDI1_N 190 Gigabit Ethernet MDI 1– Bidir 7 GPE_MDI2_P 198 Gigabit Ethernet MDI 2+ Bidir 8 GPE_MDI2_N 196 Gigabit Ethernet MDI 2– Bidir 9 GPE_MDI3_P 204 Gigabit Ethernet MDI 3+
HDMI and DisplayPort HDMI Connector Pin Description: Pin # Module Pin Name Module Pin # Usage/Description Type/Dir 1 DP1_TXD0_P 65 HDMI Transmit Data 2+ Output 2 – – Ground Ground 3 DP1_TXD0_N 63 HDMI Transmit Data 2– Output 4 DP1_TXD1_P 71 HDMI Transmit Data 1+ Output 5 – – Ground Ground 6 DP1_TXD1_N 69 HDMI Transmit Data 1– Output 7 DP1_TXD2_P 77 HDMI Transmit Data 0+ Output 8 – – Ground Ground 9 DP1_TXD2_N 75 HDMI Transmit Data 0– Output 10 DP1_TXD3_P 8
HDMI Connector Pin Description: Pin # Module Pin Name Module Pin # Usage/Description Type/Dir 1 DP0_TXD0_P 41 DP Lane 0+ Output 2 – – Ground Ground 3 DP0_TXD0_N 39 DP Lane 0– Output 4 DP0_TXD1_P 47 DP Lane 1+ Output 5 – – Ground Ground 6 DP0_TXD1_N 45 DP Lane 1– Output 7 DP0_TXD2_P 53 DP Lane 2+ Output 8 – – Ground Ground 9 DP0_TXD2_N 51 DP Lane 2– Output 10 DP0_TXD3_P 59 DP Lane 3+ Output 11 – – Ground Ground 12 DP0_TXD3_N 57 DP Lane 3– Output
M.2 Key E Expansion Slot M.2, Key E Expansion Slot Pin Description： Pin # Module Pin Name Module Pin # Usage/Description 1 – 3 USB2_D_P 123 5 USB2_D_N 121 7 – Type/Dir Ground Ground USB 2.
Pin # Module Pin Name Module Pin # Usage/Description Type/Dir – – Main 3.3V Supply Power 6 – – Unused Unused 8 I2S1_CLK 226 I2S #1 Clock Bidir, 1.8V 10 I2S1_FS 224 I2S #1 Left/Right Clock Bidir, 1.8V 12 I2S1_DIN 222 I2S #1 Data In Input, 1.8V 14 I2S1_DOUT 220 I2S #1 Data Out Bidir, 1.8V 16 – – Unused Unused 18 – – Ground Ground 20 GPIO02 124 Bluetooth #2 Wake AP Input, 3.3V 22 UART0_RXD 101 UART #0 Receive Input, 1.
M.2 Key M Expansion Slot M.
Pin # Module Pin Name Module Pin # Usage/Description Type/Dir Default – – Main 3.3V Supply Power – – Unused Unused – – Main 3.3V Supply Power – – Unused Unused 40 I2C2_SCL 232 42 I2C2_SDA 234 General I2C #2 (optional) Bidir/OD, 1.8V 44 SDMMC_DAT1 221 M.2 Key M Alert Output, 1.8V – – Unused Unused 50 PEX0_RST* 181 PCIe IF #0 Reset Output, 3.3V 52 PEX0_ CLKREQ* 180 PCIe IF #0 Clock Request Input, 3.3V 54 PEX_WAKE* 179 PCIe Wake (Level Shifted from 3.
Camera Connector Camera 0 Connector Pin Description: Pin # Module Pin Name Module Pin # Usage/Description Type/Dir Default 1 – – Ground Ground 3 CSI0_D0_N 4 5 CSI0_D0_P 6 CSI 0 Data 0 Input 7 – – Ground Ground 9 CSI0_D1_N 16 11 CSI0_D1_P 18 CSI 0 Data 1 Input 13 – – Ground Ground 15 CSI0_CLK_N 10 17 CSI0_CLK_P 12 CSI 0 Clock Input 19 – – Ground Ground 21 CAM0_PWDN 114 Camera #0 Power-down Output, 1.
Camera 1 Connector Pin Description: Pin # Module Pin Name Module Pin # Usage/Description Type/Dir 1 – – Ground Ground 3 CSI2_D0_N 22 5 CSI2_D0_P 24 CSI 2 Data 0 Input 7 – – Ground Ground 9 CSI2_D1_N 34 11 CSI2_D1_P 36 CSI 2 Data 1 Input 13 – – Ground Ground 15 CSI2_CLK_N 28 17 CSI2_CLK_P 30 CSI 2 Clock Input 19 – – Ground Ground 21 CAM1_PWDN 120 Camera #1 Power-down Output, 1.8V 23 CAM1_MCLK 122 Camera #1 Master Clock Output, 1.
40-Pin Expansion Header 40-pin : part 1 Header Pin # Module 1 –Pin Name Module Pi SoC Pin name –n # – Default Usage / D Alternate Functionality escription Main 3.3V Supply – 2 – – – Main 5.0V Supply – 3 I2C1_SDA 191 DP_AUX_CH3_N I2C #1 Data – 4 – – – Main 5.
40-pin : part 2 Type/ Dir Pin Drive or Power SoC GPIO Port # 1 Power (input) Pin 1A Max Current – PU/PD Notes on Defau on – – Mod 1 2 Power (input/output_ 1A – – – 1 3 Bidir OD ±2mA – z 2.2KΩ 2 – Header Pin # Power- 4 Power 1A – – –PU 5 Bidir OD ±2mA – z 2.2KΩ 2 –PU – 6 Ground – – – 7 Bidir/Output ±20uA PS.04 pd 3 8 Output/Bidir ±20uA PR.02 pd 3 9 Ground – – – 10 Input/Bidir ±20uA PR.03 pu 3 11 Bidir/Output ±20uA PR.
Note: 1. This is current capability per power pin. 2. These pins are connected to the SoC directly. They are open-drain (either pulled up or driven low by the SoC when configured as outputs). The max drive that meets the data sheet VOL is ±2mA. 3. These pins connect to TI TXB0108 level translators. Due to the design of these devices, the output drivers are very weak, so they can be overdriven by another connected device output for bidirectional support. 4.
Button Header Button Header Description: 1 – Module Pi Usage/Description PC_LED–n # 2 – – 3 UART2_RXD (DEBUG) 238 UART #2 Receive Input, 3.3V 4 UART2_TXD (DEBUG) 236 UART #2 Transmit Output, 3.3V 5 – – AC OK: Connect pins 5 and 6 to disable Auto- Input, 3.3V na Pin # Module Pin Name Type/Dir Default Input, 5V : ConnectsConnects to LED Cathode indicate PC_LED+: to LED to Anode (seeSystem above) Slee Output 6 – – Power-On and require press.
RTC-Coin Cell Batter Holder Coin Cell Batter Holder Pin Description: Pin # Module Pin Name Module Pin # Usage/Description Type/Dir 1 235 Power (Bidir) PMIC_BBAT Power Management IC (PMIC) real-time clock battery backup. Optionally used to provide back-up power for the RealTimeclock (RTC). Connects to coin cell (lithium or other). PMIC is supply when charging rechargeable cells. Coin cell is source when system is disconnected from power. Charging is enabled by default in software.
Fan Aluminium Heatsink Aluminum Heatsink with bigger Fan for Jetson Xavier NX Module with Long Cable, with same mounting holes design, ready to use for Xavier NX. Here is the comparison of the above heatsink with Official Xavier NX Heatsink: Official Xavier NX Heatsink 5.8CM 3.9CM Fan diameter: 3.4CM Cable length: 1.8CM Official Xavier NX Heatsink 5.8CM 4.1CM Fan diameter: 3.6CM Cable length: 9.
