reComputer J2021/J2022 Introduction reComputer J20-series are compact edge computers built with NVIDIA advanced AI embedded systems: Jetson Xavier NX and Seeed reference carrier board (J202). With rich extension modules, industrial peripherals, thermal management combined with decades of Seeed’s hardware expertise, reComputer Jetson is ready to help you accelerate and scale the next-gen AI product emerging diverse AI scenarios.
Category Introduction Part list 1 2 Jetson Xavier (production version) Xavier Performance Nano Size Powerful 21 Tops AI Performance Incredible Power Efficiency Module technical specifications 3 3 3 3 4 Seeed reference Carrier Board USB Ports Gigabit Ethernet - J6 HDMI - J5A DP - J5B M.2 Key E Expansion Slot - J20 M.
Jetson Xavier (production version) Xavier Performance Nano Size At just 70 x 45 mm, the Jetson Nano module is smaller than a credit card. But this production-ready System on Module (SOM) delivers big when it comes to deploying AI to devices at the edge across multiple industries—from smart cities and factories to agriculture and robotics. Powerful 21 Tops AI Performance Jetson Xavier NX delivers up to 21 TOPS, making it ideal for high-performance compute and AI in embedded and edge systems.
Module Technical Specifications Jetson Xavier NX Jetson Xavier NX 16GB AI Performance 21 TOPS GPU 384-core NVIDIA Volta™ GPU with 48 Tensor Cores CPU 6-core NVIDIA Carmel ARM®v8.2 64-bit CPU 6MB L2 + 4MB L3 Memory 8 GB 128-bit LPDDR4x 59.7GB/s Storage 16 GB eMMC 5.1 Power 10 W | 15 W | 20 W PCIe 1 x1 (PCIe Gen3) + 1 x4 (PCIe Gen4), total 144 GT/s* 16 GB 128-bit LPDDR4x 59.7GB/s Up to 6 cameras (24 via virtual channels) CSI Camera 14 lanes (3x4 or 6x2) MIPI CSI-2 D-PHY 1.
Seeed reference Carrier Board The Seeed reference carrier board provides several connectors with industry standard pin outs to support additional functionality beyond what is integrated on the main platform board. This includes: USB 2.0: Type C Connector USB 3.0: 2 x Type A Stacked Connectors Gigabit Ethernet: RJ45 Connector HDMI / DP: HDMI Type A and Display Port Stacked Connector M.2, Key E Socket M.
USB Port The carrier board supports several USB Connectors. One is a USB 2.0 Type C connector supporting Device mode only (including USB Recovery). There are two, dual stacked USB 3.0 Type A connectors. Each connector supports Host mode only. A single load switch supplies VBUS to all four USB 3.0 ports and is limited to 2A of output current. USB 2.
USB 3.0 Type A - J3: Pin # 1 Module Pin Name Module Pin # Net Name Usage/Description Type/Dir VBUS Supply Power 2 USB 3.0 Type A (4) 1 – – – 2 USB1_D_N 115 HUB_HSD4_N USB 2.0 #4 Data from hu b 3 USB1_D_P 117 4 – – 5 USBSS_RX_N 161 HUB_SSRX4_N USB 3.1 Receive #4 Data 6 USBSS_RX_P 163 HUB_SSRX4_P from hub 7 – – 8 USBSS_TX_N 166 9 USBSS_TX_P HUB_HSD4_P Ground Ground HUB_SSTX4_N USB 3.
USB 3.0 Type A - J4: Pin # 1 Module Pin Name Module Pin # Net Name Usage/Description Type/Dir VBUS Supply Power 2 USB 3.0 Type A (2) 1 – – – 2 USB1_D_N 115 HUB_HSD2_N 3 USB1_D_P 117 HUB_HSD2_P 4 – – 5 USBSS_RX_N 161 HUB_SSRX2_N USB 3.1 Receive #2 Data f 6 USBSS_RX_P 163 HUB_SSRX2_P rom hub 7 – – 8 USBSS_TX_N 166 HUB_SSTX2_N 9 USBSS_TX_P 168 HUB_SSTX2_P USB 2.0 #2 Data from hub Bidir Ground Ground USB 3.
Gigabit Ethernet - J6 Pin # Module Pin Name Module Pin # Net Name Usage/Description Type/Dir 1 GBE_MDI0_P 186 GBE_MDI0_P Gigabit Ethernet MDI 0+ Bidir 2 GBE_MDI0_N 184 GBE_MDI0_N Gigabit Ethernet MDI 0– Bidir 3 GBE_MDI1_P 192 GBE_MDI1_P Gigabit Ethernet MDI 1+ Bidir 4 – – – MCT – 5 – – – MCT – 6 GBE_MDI1_N 190 GBE_MDI1_N Gigabit Ethernet MDI 1– Bidir 7 GBE_MDI2_P 198 GBE_MDI2_P Gigabit Ethernet MDI 2+ Bidir 8 GBE_MDI2_N 196 GBE_MDI2_N Gigabit Ethernet MDI 2–
HDMI - J5A Pin # Module Pin Name Module Pin # Net Name Usage/Description Type/Dir 1 DP1_TXD0_P 65 HDMI Transmit Data 2+ Output 2 – – Ground Ground 3 DP1_TXD0_N 63 HDMI_TXD2_ N HDMI Transmit Data 2– Output 4 DP1_TXD1_P 71 HDMI_TXD1_ P HDMI Transmit Data 1+ Output 5 – – Ground Ground 6 DP1_TXD1_N 69 HDMI_TXD1_ N HDMI Transmit Data 1– Output 7 DP1_TXD2_P 77 HDMI_TXD0_ P HDMI Transmit Data 0+ Output 8 – – Ground Ground 9 DP1_TXD2_N 75 HDMI_TXD0_ N HDMI Transmi
DP - J5B Pin # Module Pin Name Module Pin # Net Name Usage/Description Type/Dir 1 DP0_TXD0_P 41 DP Lane 0+ Output 2 – – Ground Ground 3 DP0_TXD0_N 39 DP0_TXD0_N DP Lane 0– Output 4 DP0_TXD1_P 47 DP0_TXD1_P DP Lane 1+ Output 5 – – Ground Ground 6 DP0_TXD1_N 45 DP0_TXD1_N DP Lane 1– Output 7 DP0_TXD2_P 53 DP0_TXD2_P DP Lane 2+ Output 8 – – Ground Ground 9 DP0_TXD2_N 51 DP0_TXD2_N DP Lane 2– Output 10 DP0_TXD3_P 59 DP0_TXD3_P DP Lane 3+ Output 11 –
M.2 Key E Expansion Slot-J20 Pin # Module Pin Name Module Pin # 1 – 3 USB2_D_P 123 5 USB2_D_N 121 7 – Usage/Description Type/Dir Ground Ground USB 2.
Pin # Module Pin Name Module Pin # Usage/Description Type/Dir – – Main 3.3V Supply Power 6 – – Unused Unused 8 I2S1_CLK 226 I2S #1 Clock Bidir, 1.8V 10 I2S1_FS 224 I2S #1 Left/Right Clock Bidir, 1.8V 12 I2S1_DIN 222 I2S #1 Data In Input, 1.8V 14 I2S1_DOUT 220 I2S #1 Data Out Bidir, 1.8V 16 – – Unused Unused 18 – – Ground Ground 20 GPIO02 124 Bluetooth #2 Wake AP Input, 3.3V 22 UART0_RXD 101 UART #0 Receive Input, 1.
M.
Pin # Module Pin Name Module Pin # Usage/Description Type/Dir Default – – Main 3.3V Supply Power – – Unused Unused – – Main 3.3V Supply Power – – Unused Unused 40 I2C2_SCL 232 42 I2C2_SDA 234 General I2C #2 (optional) Bidir/OD, 1.8V 44 SDMMC_DAT1 221 M.2 Key M Alert Output, 1.8V – – Unused Unused 50 PCIE0_RST* 181 PCIe IF #0 Reset Output, 3.3V 52 PCIE0_ CLKREQ* 180 PCIe IF #0 Clock Request Input, 3.3V 54 PCIE_WAKE* 179 PCIe Wake (Level Shifted from 3.
CSI - J12 Pin # Module Pin Name Usage/Description Type/Dir 1 – Ground Ground 2 CSI0_D0_N 3 CSI0_D0_P CSI 0 Data 0 Input 4 – Ground Ground 5 CSI0_D1_N 6 CSI0_D1_P CSI 0 Data 1 Input 7 – Ground Ground 8 CSI0_CLK_N 9 CSI0_CLK_P CSI 0 Clock Input 10 – Ground Ground 11 CAM0_PWDN Camera #0 Power-down Output 12 CAM0_MCLK Camera #0 Master Clock Output 13 CAM0_I2C_SCL Camera I2C. 2.2kΩ pull-ups on module. 2.2kΩ pull-ups on the carrier board.
CSI - J9 Pin # Module Pin Name Usage/Description Type/Dir 1 – Ground Ground 2 CSI2_D0_N 3 CSI2_D0_P CSI 2 Data 0 Input 4 – Ground Ground 5 CSI2_D1_N 6 CSI2_D1_P CSI 2 Data 1 Input 7 – Ground Ground 8 CSI2_CLK_N 9 CSI2_CLK_P CSI 2 Clock Input 10 – Ground Ground 11 CAM1_PWDN Camera #1 Power-down Output 12 CAM1_MCLK Camera #1 Master Clock Output 13 CAM1_I2C_SCL Camera I2C. 2.2kΩ pull-ups on module. 2.2kΩ pull-ups on the carrier board.
40 Pin Expansion Header - J10 Header Pin # Module Pin Name Module Pin # SoC Pin name Default Usage / Description Alternate Functionality 1 – – – Main 3.3V Supply – 2 – – – Main 5.0V Supply – 3 I2C1_SDA 191 DP_AUX_CH3_N I2C #1 Data – 4 – – – Main 5.
Header Pin # Type/ Dir Pin Drive or Power Pin Max Current SoC GPIO Port # Power- on Default PU/PD on Module Notes 1 Power (input) 1A – – – 1 2 Power (input/output_ 1A – – – 1 3 Bidir OD ±2mA – z 2.2KΩ PU 2 4 Power 1A – – – – 5 Bidir OD ±2mA – z 2.2KΩ PU 2 6 Ground – – – – – 7 Bidir/Output ±20uA PS.04 pd 3 8 Output/Bidir ±20uA PR.02 pd 3 9 Ground – – – 10 Input/Bidir ±20uA PR.03 pu 3 Bidir/Output ±20uA PR.
Note: 1. This is current capability per power pin. 2. These pins are connected to the SoC directly. They are open-drain (either pulled up or driven low by the SoC when configured as outputs). The max drive that meets the data sheet VOL is ±2mA. 3. These pins connect to TI TXB0108 level translators. Due to the design of these devices, the output drivers are very weak, so they can be overdriven by another connected device output for bidirectional support. 4.
Button Header - J15 Pin # Module Pin Name Module Pin # 1 – Net Name Usage/Description Type/Dir Default PC_LED– : Connects to LED Cathode to indicate System Sl Input, 5V eep/Wake (Off when system in sleep mode) 2 – – 3 UART2_RXD (DEBUG) 238 4 UART2_TXD (DEBUG) 236 5 – – 6 – – Auto Power-on disable: Pulled to GND. See Pin 5.
RTC-Coin Cell Batter Holder - J19 Pin # Module Pin Name 1 Module Pin # Net Name – Usage/Description Type/Dir Default Ground Ground Power Management IC (PMIC) real-time clock battery back-up. Optionally used to provide backup power for the Real-Time-Clock (RTC). Connects to coin cell (lithium or other). PMIC is 2 PMIC_BBAT 235 BBAT supply when charging rechargeable cells. Coin Power cell is source when system is disconnected from power. Charging is enabled by default in software.
Fan Aluminium Heatsink Aluminum Heatsink with bigger Fan for Jetson Xavier NX Module with Long Cable, with same mounting holes design, ready to use for Xavier NX. Here is the comparison with Official Xavier NX Heatsink, see below: Official Xavier NX Heatsink 5.8CM 3.9CM Fan diameter: 3.4CM Cable length: 1.8CM Xavier NX Heatsink with long cable 5.8CM 4.1CM Fan diameter: 3.6CM Cable length: 9.
