reComputer Jetson-10-1-H0 Introduction reComputer Jetson-10-1 series are compact edge computers built with NVIDIA advanced AI embedded system Jetson Nano and Seeed reference carrier board v1. With rich extension modules, industrial peripherals, thermal management combined with decades of Seeed Studio hardware expertise, reComputer Jetson is ready to help you accelerate and scale the next-gen AI product emerging diverse AI scenarios.
Category Introduction Part list 1 2 Module - Jetson Nano (production version) A new dimension in AI Big compute performance Low power demands Module technical specifications 3 3 3 3 4 Seeed reference Carrier Board v1 USB Ports Gigabit Ethernet HDMI and Display Port M.
Module - Jetson Nano (production version) A new dimension in AI At just 70 x 45 mm, the Jetson Nano module is smaller than a credit card. But this production-ready System on Module (SOM) delivers big when it comes to deploying AI to devices at the edge across multiple industries—from smart cities and factories to agriculture and robotics. Big compute perormance Jetson Nano delivers 472 GFLOPs for taking on modern AI algorithms.
Module Technical Specifications GPU NVIDIA Maxwell architecture with 128 NVIDIA CUDA® cores CPU Quad-core ARM Cortex-A57 MPCore processor Memory 4 GB 64-bit LPDDR4, 1600MHz 25.6 GB/s Storage 16 GB eMMC 5.
Seeed reference Carrier Board v1 Note: When Jetson Nano is used, the M.2 E KEY and CAN cannot work The Seeed reference carrier board provides several connectors with industry standard pin outs to support additional functionality beyond what is integrated on the main platform board. These connectors are: USB 2.0: Micro B Connector USB 3.0: 4 x Type A Connectors Gigabit Ethernet: RJ45 Connector HDMI / DP: HDMI Type A and DisplayPort Stacked Connector M.
USB Port The carrier board supports two USB Connectors. One is a USB 2.0 Micro B connector supporting Device mode only (including USB Recovery). There are two, dual stacked USB 3.0 Type A connectors. Each connector supports Host mode only. A single load switch supplies VBUS to all four USB 3.0 ports and is limited to 2A of output current. USB 2.0 Micro B Connector Pin Description: Pin # Module Pin Name Usage and Description Type/Dir 1 – VBUS Supply Power 2 USB0_D_N 3 USB0_D_P USB 2.
USB 3.0 Type A Connector Pin Descriptions: Pin # Module Pin Name 1 Usage/Description Type/Dir 2 VBUS Supply Power USB 2.0 #2 Data from hub Bidir Ground Ground USB 3.0 Receive #2 Data from hub Input Ground Ground USB 3.0 Transmit #2 Data from hub Output VBUS Supply Power USB 2.0 Data #1 Data from hub Bidir Ground Ground USB 3.0 Receive #1 Data from hub Input Ground Ground USB 3.0 Transmit #1 Data from hub Output USB 3.
USB 3.0 Type A Connector Pin Descriptions: Pin # Module Pin Name1 Usage/Description Type/Dir2 VBUS Supply Power USB 2.0 #4 Data from hub Bidir Ground Ground USB 3.0 Receive #4 Data from hub Input Ground Ground USB 3.0 Transmit #4 Data from hub Output VBUS Supply Power USB 2.0 Data #3 Data from hub Bidir Ground Ground USB 3.0 Receive #3 Data from hub Input Ground Ground USB 3.0 Transmit #3 Data from hub Output USB 3.
Gigabit Ethernet Ethernet RJ45 Connector Pin Description: Pin # Module Pin Name Usage/Description Type/Dir 1 GPE_MDI0_P Gigabit Ethernet MDI 0+ Bidir 2 GPE_MDI0_N Gigabit Ethernet MDI 0– Bidir 3 GPE_MDI1_P Gigabit Ethernet MDI 1+ Bidir 4 – MCT – 5 – MCT – 6 GPE_MDI1_N Gigabit Ethernet MDI 1– Bidir 7 GPE_MDI2_P Gigabit Ethernet MDI 2+ Bidir 8 GPE_MDI2_N Gigabit Ethernet MDI 2– Bidir 9 GPE_MDI3_P Gigabit Ethernet MDI 3+ Bidir 10 GPE_MDI3_N Gigabit Ethernet MDI 3– Bid
HDMI and DisplayPort HDMI Connector Pin Description: Pin # Module Pin Name Usage/Description Type/Dir 1 DP1_TXD0_P HDMI Transmit Data 2+ Output 2 – Ground Ground 3 DP1_TXD0_N HDMI Transmit Data 2– Output 4 DP1_TXD1_P HDMI Transmit Data 1+ Output 5 – Ground Ground 6 DP1_TXD1_N HDMI Transmit Data 1– Output 7 DP1_TXD2_P HDMI Transmit Data 0+ Output 8 – Ground Ground 9 DP1_TXD2_N HDMI Transmit Data 0– Output 10 DP1_TXD3_P HDMI Transmit Clock+ Output 11 – Ground Gro
DP Connector Pin Description: DP Module Pin Name Connec DP0_TXD0_P 1 Usage/Description Type/Dir DP Lane 0+ Output 2 – Ground Ground 3 DP0_TXD0_N DP Lane 0– Output 4 DP0_TXD1_P DP Lane 1+ Output 5 – Ground Ground 6 DP0_TXD1_N DP Lane 1– Output 7 DP0_TXD2_P DP Lane 2+ Output 8 – Ground Ground 9 DP0_TXD2_N DP Lane 2– Output 10 DP0_TXD3_P DP Lane 3+ Output 11 – Ground Ground 12 DP0_TXD3_N DP Lane 3– Output 13 – 14 – 15 DP0_AUX_N MODE: Selects between DP a
M.2 Key E Expansion Slot M.
Pin # 2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36 38 40 42 44 46 48 50 52 54 56 58 60 62 64 66 68 70 72 74 Module Pin Name Usage/Description Type/Dir Default – Main 3.3V Supply Power – Unused Unused – Main 3.3V Supply Power – Unused Unused General I2C #2 (optional) Bidir/OD, 1.8V M.2 Key M Alert Output, 1.8V – Unused Unused PEX0_RST* PEX0_ CLKREQ* PEX_WAKE* PCIe IF #0 Reset PCIe IF #0 Clock Request PCIe Wake (Level Shifted from 3.3V Output, 3.3V Input, 3.3V Input, 3.
Camera Connector Camera 0 Connector Pin Description: Pin # Module Pin Name Usage/Description Type/Dir 1 – Ground Ground 3 CSI0_D0_N 5 CSI0_D0_P CSI 0 Data 0 Input 7 – Ground Ground 9 CSI0_D1_N 11 CSI0_D1_P CSI 0 Data 1 Input 13 – Ground Ground 15 CSI0_CLK_N 17 CSI0_CLK_P CSI 0 Clock Input 19 – Ground Ground 21 CAM0_PWDN Camera #0 Power-down Output, 1.8V 23 CAM0_MCLK Camera #0 Master Clock Output, 1.8V 25 CAM_I2C_SCL 27 CAM_I2C_SDA Camera I2C. 2.
Pin # Module Pin Name 2 – 4 – 6 – 8 – 10 – 12 – 14 – 16 – 18 – 20 – 22 – 24 – 26 – 28 – 30 – Usage/Description Type/Dir Not Used – Note: In the Type/Dir column, Output is to camera module. Input is from camera module. Bidir is for bidirectional signals.
Camera 1 Connector Pin Description: Pin # Module Pin Name Usage/Description Type/Dir 1 – Ground Ground 3 CSI2_D0_N 5 CSI2_D0_P CSI 2 Data 0 Input 7 – Ground Ground 9 CSI2_D1_N 11 CSI2_D1_P CSI 2 Data 1 Input 13 – Ground Ground 15 CSI2_CLK_N 17 CSI2_CLK_P CSI 2 Clock Input 19 – Ground Ground 21 CAM1_PWDN Camera #1 Power-down Output, 1.8V 23 CAM1_MCLK Camera #1 Master Clock Output, 1.8V 25 CAM_I2C_SCL 27 CAM_I2C_SDA Camera I2C. 2.2kΩ pull-ups on Output, 3.
Pin # Module Pin Name 2 – 4 – 6 – 8 – 10 – 12 – 14 – 16 – 18 – 20 – 22 – 24 – 26 – 28 – 30 – Usage/Description Type/Dir Not Used – Note: In the Type/Dir column, Output is to camera module. Input is from camera module. Bidir is for bidirectional signals.
40-Pin Expansion Header 40-pin : part 1 Module Pin Name SoC Pin name Default Usage / Descripti Alternate Functionality Type/ Dir 1 – – on Main 3.3V Supply – Power (input) 2 – – Main 5.
40-pin : part 2 Header Pin # Pin Drive SoC GPIO Port # Power- on Default PU/PD on Module Notes 1 or Power 1A – – – 1 2 1A – – – 1 3 ±2mA – z 2.2KΩ PU 2 4 1A – – – – 5 ±2mA – z 2.2KΩ PU 2 6 – – – – – 7 ±20uA PS.04 pd 3 8 ±20uA PR.02 pd 3 9 – – – 10 ±20uA PR.03 pu 3 11 ±20uA PR.04 pd 3 12 ±20uA PT.05 pd 3 13 ±20uA PY.00 pd 3 14 – – – 15 ±20uA PCC.04 pd 3 16 ±20uA PY.04 pu 3 17 1A – – 18 ±20uA PY.
Note: 1. This is current capability per power pin. 2. These pins are connected to the SoC directly. They are open-drain (either pulled up or driven low by the SoC when configured as outputs). The max drive that meets the data sheet VOL is ±2mA. 3. These pins connect to TI TXB0108 level translators. Due to the design of these devices, the output drivers are very weak, so they can be overdriven by another connected device output for bidirectional support. 4.
Button Header Button Header Description: Pin # Module Pin Name Usage/Description Type/Dir Default PC_LED1 – : Connects to LED Cathode to indicate System Sl Input, 5V eep/Wake (Off when system in sleep mode) 2 – 3 UART2_RXD (DEBUG) UART #2 Receive Input, 3.3V 4 UART2_TXD (DEBUG) UART #2 Transmit Output, 3.3V 5 – 6 – Auto Power-on disable: Pulled to GND. See Pin 5. na 7 – Ground 8 SYS_RESET* Temporarily connect pins 7 and 8 to reset system Input, 1.
RTC-Coin Cell Batter Holder Coin Cell Batter Holder Pin Description: Pin # Module Pin Name Usage/Description Type/Dir 1 PMIC_BBAT Power Management IC (PMIC) real-time clock battery back-up. Optionally used to provide back-up power for the Real-Timeclock (RTC). Connects to coin cell (lithium or other). PMIC is supply when charging Power (Bidir) rechargeable cells. Coin cell is source when system is disconnected from power. Charging is enabled by default in software.
Passive aluminum heatsink Original NVIDIA Jetson Nano Passive Heat Sink Designed to fit the NVIDIA Jetson Nano modules Dimensions: 58.7 mm x 39.4mm x 17.3mm Aluminium Heatsink Overall dimension: 130mm x120mm x 50mm More information Please check our Wiki and ask question at our Forum or Discord community.
