SH1107
6
Pad Configuration
Chip Outline Dimensions
Item Pad No. Size (µm)
X Y
Chip boundary - 8256 732
Chip height All pads 300
I/O 95 40
SEG 15 110
Bump size
COM 15 110
COM 30
SEG 28
Pad pitch
I/O
110
Bump height All pads 9±2
Alignment Mark Location Unit: µm
NO X Y
ALK_L
-3960 -163
ALK_R
3960 -163
