Datasheet

SH1107
3
Pad Description
Power Supply
Pad NO. Symbol I/O Description
34，35 VDD Supply 1.65 - 3.5V Power supply for logic and input.
39 VDD O VDD output for pad option.
16，17 AVDD Supply 2.4 - 3.5V power supply for the internal buffer of the DC-DC voltage converter.
25 VSS Supply Ground for analog.
26 VSS Supply Ground for logic.
2-6,27
68-72
VSS Supply Ground for buffer.
37，41 VSS O Ground output for pad option.
23，24 VSL Supply
This is a segment voltage reference pad.
This pad should be connected to VSS externally.
28-32 VCL Supply
This is a common voltage reference pad.
This pad should be connected to VSS externally.
7-10
21-22
64-67
VPP Supply
This is the most positive voltage supply pad of the chip.
It should be supplied externally.
OLED Driver Supplies
Pad NO. Symbol I/O Description
42-43 IREF O
This is a s
egment current reference pad. A resistor should be connected between this pad and
VSS. Set the current at 15.625µA.
11-13 VCOMH O
This is a pad for the voltage output high level for common signals.
A capacitor should be connected between this pad and VSS.
18 VBREF O
This is an internal voltage reference pad for booster circuit.
A capacitor should be connected between this pad and VSS.
14-15 SW O This is an output pad driving the gate of the external NMOS of the booster circuit.
19 FB I
This is a feedback resistor input pad for the booster circuit.
It is used to adjust the booster output voltage level, VPP
20 SENSE I This is a source current pad of the external NMOS of the booster circuit.