Datasheet

Table Of Contents
Table 58-16. Package Reference
JEDEC Drawing Reference MS-026
JESD97 Classification E3
58.4 Soldering Profile
The following table gives the recommended soldering profile from J-STD-20.
Table 58-17. Recommended Soldering Profile
Profile Feature Green Package
Average Ramp-up Rate (217°C to peak) 3°C/s max.
Preheat Temperature 175°C ±25°C 150-200°C
Time Maintained Above 217°C 60-150s
Time within 5°C of Actual Peak Temperature 30s
Peak Temperature Range 260°C
Ramp-down Rate 6°C/s max.
Time 25°C to Peak Temperature 8 minutes max.
A maximum of three reflow passes is allowed per component.
SAM D5x/E5x Family Data Sheet
Packaging Information
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Datasheet
DS60001507E-page 2095