Datasheet

Table Of Contents
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2Contact Pad Spacing
Contact Pitch
MILLIMETERS
0.50 BSC
MIN
E
MAX
7.00 BSC
Contact Pad Width (X20) X 0.25
NOM
C1Contact Pad Spacing 7.00 BSC
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M1.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing C04-23465 Rev A
120-Ball Thin Fine Pitch Ball Grid Array Package (DGB) - 8x8 mm Body [TFBGA]
C1
C2
E
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
ØX
SILK SCREEN
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2093