Datasheet

Table Of Contents
Number of Terminals
Overall Height
Terminal Width
Overall Width
Exposed Pad Width
Substrate Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E1
A2
e
E
N
0.50 BSC
0.20
-
0.11
-
7.00 BSC
-
-
8.00 BSC
MILLIMETERS
MIN
NOM
120
0.30
1.20
0.21
MAX
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Overall Length
Overall Ball Pitch
D
D1
8.00 BSC
7.00 BSC
Microchip Technology Drawing C04-21465 Rev A Sheet 1 of 2
120-Ball Thin Fine Pitch Ball Grid Array Package (DGB) - 8x8 mm Body [TFBGA]
DETAIL A
A1
0.08 C
120X
(A2)
(A3)
2.10 REF
0.70 REF
A3
Mold Cap Thickness
0.10
C
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2092