Datasheet

Table Of Contents
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
4.80
4.80
MILLIMETERS
0.50 BSC
MIN
E
MAX
8.90
Contact Pad Length (X64)
Contact Pad Width (X64)
Y1
X1
0.85
0.30
NOM
1
2
64
C1Contact Pad Spacing 8.90
Contact Pad to Contact Pad (X60) G2 0.20
Thermal Via Diameter V
Thermal Via Pitch EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2018 Microchip Technology Inc.
Contact Pad to Center Pad (X64) G1 1.63
EV
EV
C2
C1
X2
Y2
E
X1
Y1
G1
G2
ØV
SILK SCREEN
Microchip Technology Drawing C04-23497 Rev A
64-Lead Very Thin Plastic Quad Flat, No Lead Package (U6B) - 9x9 mm Body [VQFN]
With 4.7 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy ZRB
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2086