Datasheet

Table Of Contents
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2018 Microchip Technology Inc.
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
2.
3.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.50 BSC
0.203 REF
0.35
0.15
0.80
0.00
0.20
0.40
0.85
0.035
MILLIMETERS
MIN
NOM
64
0.45
0.25
0.90
0.05
MAX
K 1.75 REFTerminal-to-Exposed-Pad
Overall Length
Exposed Pad Length
D
D2
4.60
9.00 BSC
4.70 4.80
Wettable Flank Step Length
D3
- - 0.085
A4 -0.10 0.19Wettable Flank Step Height
4.60
9.00 BSC
4.70 4.80
Microchip Technology Drawing C04-21497 Rev A Sheet 1 of 2
64-Lead Very Thin Plastic Quad Flat, No Lead Package (U6B) - 9x9 mm Body [VQFN]
With 4.7 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy ZRB
DETAIL 1
ALTERNATE TERMINAL
CONFIGURATIONS
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2085