Datasheet

Table Of Contents
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
© 2018 Microchip Technology Inc.
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1.
2.
3.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-21493 Rev A Sheet 2 of 2
48-Lead Very Thin Plastic Quad Flat, No Lead Package (U5B) - 7x7 mm Body [VQFN]
With 5.15 mm Exposed Pad and Stepped Wettable Flanks; Atmel Legacy ZLH
Number of Terminals
Overall Height
Terminal Width
Overall Width
Terminal Length
Exposed Pad Width
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
E2
A3
e
L
E
N
0.50 BSC
0.203 REF
0.35
0.20
0,80
0.00
0.25
0.40
0.85
0.02
MILLIMETERS
MIN
NOM
48
0.45
0.30
0.90
0.05
MAX
K 0.53 REFTerminal-to-Exposed-Pad
Overall Length
Exposed Pad Length
D
D2
5.05
7.00 BSC
5.15 5.25
5.05
7.00 BSC
5.15 5.25
Wettable Flank Step Length
D3
- - 0.085
A4 -0.10 0.19Wettable Flank Step Height
DETAIL 1
ALTERNATE TERMINAL
CONFIGURATIONS
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2078