Datasheet

Table Of Contents
58.3.1 48-Pin VQFN
Note:  The exposed die attach pad is not connected electrically inside the device.
Table 58-2. Device and Package Maximum Weight
140 mg
Table 58-3. Package Characteristics
Moisture Sensitivity Level MSL3
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2075