Datasheet

Table Of Contents
θ
HEATSINK
= Thermal resistance (°C/W) specification of the external cooling device
P
D
= Device power consumption (W)
T
A
= Ambient temperature (°C)
From the first equation, the user can derive the estimated lifetime of the chip and decide whether a
cooling device is necessary or not. If a cooling device has to be fitted on the chip, the second equation
must be used to compute the resulting average chip-junction temperature T
J
in °C.
58.3 Package Drawings
Note:  For current package drawings, refer to the Microchip Packaging Specification, which is available
at http://www.microchip.com/packaging.
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2074