Datasheet

58. Packaging Information
58.1 Package Marking Information
All devices are marked with Atmel logo and ordering code.
Additional marking information is as follows:
• "YY": Manufacturing year
• "WW": Manufacturing week
• "R": Internal Code
• "XXXXXX": Lot number
58.2 Thermal Considerations
58.2.1 Thermal Resistance Data
The following table summarizes the thermal resistance data depending on the package.
Table 58-1. Thermal Resistance Data
Package Type θ
JA
θ
JC
64-pin TQFP 57.4°C/W 10.6°C/W
100-pin TQFP 55.0°C/W 11.1°C/W
128-pin TQFP 48.7°C/W 9.4°C/W
120-pin TFBGA 36.63°C/W 12.2°C/W
48-pin VQFN 29.8°C/W 10.0°C/W
64-pin VQFN 30.3°C/W 9.9°C/W
64-pin WLCSP 36.8°C/W 5.0°C/W
58.2.2 Junction Temperature
The average chip-junction temperature, T
J
, in °C can be obtained from the following equations:
• Equation 1- T
J
= T
A
+ (P
D
x θ
JA
)
• Equation 2 - T
J
= T
A
+ (P
D
x (θ
HEATSINK
+ θ
JC
))
where:
• θ
JA
= Package thermal resistance, Junction-to-ambient (°C/W), see Thermal Resistance Data
• θ
JC
= Package thermal resistance, Junction-to-case thermal resistance (°C/W), see Thermal
Resistance Data
SAM D5x/E5x Family Data Sheet
Packaging Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 2073