Datasheet

2. Ordering Information
Figure 2-1. Composition of the Ordering Numbers
(1)
A = Default Variant
Product Family
E54 = Cortex-M4F + Advanced Feature Set + Ethernet
G = 48 Pins
J = 64 Pins
N = 100 Pins
P = 120/128 Pins
T = Tape and Reel
U = -40°C to +85°C Matte Sn Plating
N = -40°C to +105°C Matte Sn Plating
F = -40°C to +125°C Matte Sn Plating
Z = -40°C to +125°C Matte Sn Plating
(AEC-Q100 Qualified)
A = TQFP
CT = TFBGA
M = VQFN
U = WLCSP
+ 2x CAN
Product Series
Flash Memory Density
Device Variant
Pin Count
Package Carrier
Package Grade
Package Type
20 = 1 MB
19 = 512 KB
18 = 256 KB
SAM = SMART ARM Microcontroller
E53 = Cortex-M4F + Advanced Feature Set + Ethernet
E51 = Cortex-M4F + Advanced Feature Set + 2x CAN
SAM E54 N 19 A - A U T - EFP
D51 = Cortex-M4F + Advanced Feature Set
[no letter T] = Tray
(2,3)
(4)
(5)
EFP = Extended Flash Performance
(6)
[no EFP] = Standard Flash Performance
(8)
Note:
1. Not all combinations are valid. The available device part numbers are listed in Configuration
Summary.
2. Devices in the WLCSP package include a factory programmed Bootloader. Contact your local
Microchip sales office for additional information.
3. WLCSP package type is available only with the package Grade U and N.
4. Package Grade N is available with only package type U.
5. The AEC-Q100 Grade 1 qualified version is only offered in the TQFP and VQFN packages. The
VQFN package will have wettable flanks, and both TQFP and VQFN packages are assembled with
gold bond wires.
6. EFP is only available for package Grade U.
7. EFP is an ordering code extension and will not be printed onto the package marking (section 58.1:
Package Marking Information).
8. E51G devices have only 1 instance of CAN.
SAM D5x/E5x Family Data Sheet
Ordering Information
© 2019 Microchip Technology Inc.
Datasheet
DS60001507E-page 19