Datasheet
Table Of Contents
- Spartan-7 FPGAs Data Sheet: DC and AC Switching Characteristics
- Introduction
- DC Characteristics
- Power-On/Off Power Supply Sequencing
- DC Input and Output Levels
- AC Switching Characteristics
- Performance Characteristics
- IOB Pad Input/Output/3-State
- I/O Standard Adjustment Measurement Methodology
- Input/Output Logic Switching Characteristics
- Input Serializer/Deserializer Switching Characteristics
- Output Serializer/Deserializer Switching Characteristics
- Input/Output Delay Switching Characteristics
- CLB Switching Characteristics
- CLB Distributed RAM Switching Characteristics (SLICEM Only)
- CLB Shift Register Switching Characteristics (SLICEM Only)
- Block RAM and FIFO Switching Characteristics
- DSP48E1 Switching Characteristics
- Clock Buffers and Networks
- MMCM Switching Characteristics
- PLL Switching Characteristics
- Device Pin-to-Pin Output Parameter Guidelines
- Device Pin-to-Pin Input Parameter Guidelines
- Additional Package Parameter Guidelines
- XADC Specifications
- Configuration Switching Characteristics
- eFUSE Programming Conditions
- References
- Revision History
- Please Read: Important Legal Notices
Spartan-7 FPGAs Data Sheet: DC and AC Switching Characteristics
DS189 (v1.9) March 13, 2019 www.xilinx.com
Product Specification 2
V
IN
(2)(3)(4)
I/O input voltage. –0.4 V
CCO
+0.55 V
I/O input voltage (when V
CCO
=3.3V) for V
REF
and differential I/O
standards except TMDS_33.
(5)
–0.4 2.625 V
V
CCBATT
Key memory battery backup supply. –0.5 2.0 V
XADC
V
CCADC
XADC supply relative to GNDADC. –0.5 2.0 V
V
REFP
XADC reference input relative to GNDADC. –0.5 2.0 V
Temperature
T
STG
Storage temperature (ambient). –65 150 °C
T
SOL
Maximum soldering temperature for Pb/Sn component bodies.
(6)
–+220°C
Maximum soldering temperature for Pb-free component bodies.
(6)
–+260°C
T
j
Maximum junction temperature.
(6)
–+125°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability.
2. The lower absolute voltage specification always applies.
3. For I/O operation, refer to the 7 Series FPGAs SelectIO Resources User Guide (UG471) [Ref 3].
4. The maximum limit applies to DC signals. For maximum undershoot and overshoot AC specifications, see Table 4.
5. See Table 9 for TMDS_33 specifications.
6. For soldering guidelines and thermal considerations, see the 7 Series FPGA Packaging and Pinout Specification (UG475) [Ref 4].
Table 1: Absolute Maximum Ratings
(1)
(Cont’d)
Symbol Description Min Max Units
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