Datasheet
Table Of Contents
- RP2040 Datasheet
- Colophon
- Chapter 1. Introduction
- Chapter 2. System Description
- 2.1. Bus Fabric
- 2.2. Address Map
- 2.3. Processor subsystem
- 2.4. Cortex-M0+
- 2.4.1. Features
- 2.4.2. Functional Description
- 2.4.3. Programmer’s model
- 2.4.4. System control
- 2.4.5. NVIC
- 2.4.6. MPU
- 2.4.7. Debug
- 2.4.8. List of Registers
- 2.5. Memory
- 2.6. Boot Sequence
- 2.7. Bootrom
- 2.7.1. Bootrom Source
- 2.7.2. Processor Controlled Boot Sequence
- 2.7.3. Bootrom Contents
- 2.7.4. USB Mass Storage Interface
- 2.7.5. USB PICOBOOT Interface
- 2.8. Power Supplies
- 2.9. On-Chip Voltage Regulator
- 2.10. Power Control
- 2.11. Chip-Level Reset
- 2.12. Power-On State Machine
- 2.13. Subsystem Resets
- 2.14. Clocks
- 2.14.1. Overview
- 2.14.2. Clock sources
- 2.14.2.1. Ring Oscillator
- 2.14.2.1.1. Mitigating ROSC frequency variation due to process
- 2.14.2.1.2. Mitigating ROSC frequency variation due to voltage
- 2.14.2.1.3. Mitigating ROSC frequency variation due to temperature
- 2.14.2.1.4. Automatic mitigation of ROSC frequency variation due to PVT
- 2.14.2.1.5. Automatic overclocking using the ROSC
- 2.14.2.2. Crystal Oscillator
- 2.14.2.3. External Clocks
- 2.14.2.4. Relaxation Oscillators
- 2.14.2.5. PLLs
- 2.14.2.1. Ring Oscillator
- 2.14.3. Clock Generators
- 2.14.4. Frequency Counter
- 2.14.5. Resus
- 2.14.6. Programmer’s Model
- 2.14.7. List of registers
- 2.15. Crystal Oscillator (XOSC)
- 2.16. Ring Oscillator (ROSC)
- 2.17. PLL
- 2.18. GPIO
- 2.19. Sysinfo
- 2.20. Syscfg
- Chapter 3. PIO
- Chapter 4. Peripherals
- 4.1. USB
- 4.2. DMA
- 4.3. UART
- 4.4. I2C
- 4.4.1. Features
- 4.4.2. IP Configuration
- 4.4.3. I2C Overview
- 4.4.4. I2C Terminology
- 4.4.5. I2C Behaviour
- 4.4.6. I2C Protocols
- 4.4.7. Tx FIFO Management and START, STOP and RESTART Generation
- 4.4.8. Multiple Master Arbitration
- 4.4.9. Clock Synchronization
- 4.4.10. Operation Modes
- 4.4.11. Spike Suppression
- 4.4.12. Fast Mode Plus Operation
- 4.4.13. Bus Clear Feature
- 4.4.14. IC_CLK Frequency Configuration
- 4.4.15. DMA Controller Interface
- 4.4.16. List of Registers
- 4.5. SPI
- 4.5.1. Overview
- 4.5.2. Functional Description
- 4.5.3. Operation
- 4.5.3.1. Interface reset
- 4.5.3.2. Configuring the SSP
- 4.5.3.3. Enable PrimeCell SSP operation
- 4.5.3.4. Clock ratios
- 4.5.3.5. Programming the SSPCR0 Control Register
- 4.5.3.6. Programming the SSPCR1 Control Register
- 4.5.3.7. Frame format
- 4.5.3.8. Texas Instruments synchronous serial frame format
- 4.5.3.9. Motorola SPI frame format
- 4.5.3.10. Motorola SPI Format with SPO=0, SPH=0
- 4.5.3.11. Motorola SPI Format with SPO=0, SPH=1
- 4.5.3.12. Motorola SPI Format with SPO=1, SPH=0
- 4.5.3.13. Motorola SPI Format with SPO=1, SPH=1
- 4.5.3.14. National Semiconductor Microwire frame format
- 4.5.3.15. Examples of master and slave configurations
- 4.5.3.16. PrimeCell DMA interface
- 4.5.4. List of Registers
- 4.6. PWM
- 4.7. Timer
- 4.8. Watchdog
- 4.9. RTC
- 4.10. ADC and Temperature Sensor
- 4.11. SSI
- 4.11.1. Overview
- 4.11.2. Features
- 4.11.3. IP Modifications
- 4.11.4. Clock Ratios
- 4.11.5. Transmit and Receive FIFO Buffers
- 4.11.6. 32-Bit Frame Size Support
- 4.11.7. SSI Interrupts
- 4.11.8. Transfer Modes
- 4.11.9. Operation Modes
- 4.11.10. Partner Connection Interfaces
- 4.11.11. DMA Controller Interface
- 4.11.12. APB Interface
- 4.11.13. List of Registers
- Chapter 5. Electrical and Mechanical
- Appendix A: Register Field Types
- Appendix B: Errata
Table 650. ADC
characteristics
Parameter Symbol Minimum Maximum Units Comment
ADC Input Voltage
Range
V
PIN_ADC
0 ADC_IOVDD V
Effective Number
of Bits
ENOB 9 bits Simulated
Resolved Bits 12 bits
Table 651. Oscillator
pin characteristics
when using a Square
Wave input
Parameter Symbol Minimum Maximum Units Comment
Input Voltage High V
IH
0.65*IOVDD IOVDD + 0.3 V XIN only. XOUT
floating
Input Voltage Low V
IL
0 0.35*IOVDD V XIN only. XOUT
floating
See Crystal Oscillator for more details on the Oscillator, and Minimal Design Example for information on crystal usage.
5.2.3.5. Interpreting GPIO output voltage specifications
The GPIOs on RP2040 have four different output drive strengths, which are nominally called 2, 4, 8 and 12mA modes.
These are not hard limits, nor do they mean that they will always be sourcing (or sinking) the selected amount of
milliamps. The amount of current a GPIO sources or sinks is dependant on the load attached to it. It will attempt to drive
the output to the IOVDD level (or 0V in the case of a logic 0), but the amount of current it is able to source is limited, which
will be dependant on the selected drive strength. Therefore the higher the current load is, the lower the voltage will be at
the pin. At some point, the GPIO will be sourcing so much current, that the voltage is so low, it won’t be recognised as a
logic 1 by the input of a connected device. The purpose of the output specifcations in Table 648 are to try and quantify
how much lower the voltage can be expected to be, when drawing specified amounts of current from the pin.
The Output High Voltage (V
OH
) is defined as the lowest voltage the output pin can be when driven to a logic 1 with a
particular selected drive strength; e.g., 4mA being sourced by the pin whilst in 4mA drive strength mode. The Output Low
Voltage is similar, but with a logic 0 being driven.
RP2040 Datasheet
5.2. Pinout 635