Datasheet
Table Of Contents
- RP2040 Datasheet
- Colophon
- Chapter 1. Introduction
- Chapter 2. System Description
- 2.1. Bus Fabric
- 2.2. Address Map
- 2.3. Processor subsystem
- 2.4. Cortex-M0+
- 2.4.1. Features
- 2.4.2. Functional Description
- 2.4.3. Programmer’s model
- 2.4.4. System control
- 2.4.5. NVIC
- 2.4.6. MPU
- 2.4.7. Debug
- 2.4.8. List of Registers
- 2.5. Memory
- 2.6. Boot Sequence
- 2.7. Bootrom
- 2.7.1. Bootrom Source
- 2.7.2. Processor Controlled Boot Sequence
- 2.7.3. Bootrom Contents
- 2.7.4. USB Mass Storage Interface
- 2.7.5. USB PICOBOOT Interface
- 2.8. Power Supplies
- 2.9. On-Chip Voltage Regulator
- 2.10. Power Control
- 2.11. Chip-Level Reset
- 2.12. Power-On State Machine
- 2.13. Subsystem Resets
- 2.14. Clocks
- 2.14.1. Overview
- 2.14.2. Clock sources
- 2.14.2.1. Ring Oscillator
- 2.14.2.1.1. Mitigating ROSC frequency variation due to process
- 2.14.2.1.2. Mitigating ROSC frequency variation due to voltage
- 2.14.2.1.3. Mitigating ROSC frequency variation due to temperature
- 2.14.2.1.4. Automatic mitigation of ROSC frequency variation due to PVT
- 2.14.2.1.5. Automatic overclocking using the ROSC
- 2.14.2.2. Crystal Oscillator
- 2.14.2.3. External Clocks
- 2.14.2.4. Relaxation Oscillators
- 2.14.2.5. PLLs
- 2.14.2.1. Ring Oscillator
- 2.14.3. Clock Generators
- 2.14.4. Frequency Counter
- 2.14.5. Resus
- 2.14.6. Programmer’s Model
- 2.14.7. List of registers
- 2.15. Crystal Oscillator (XOSC)
- 2.16. Ring Oscillator (ROSC)
- 2.17. PLL
- 2.18. GPIO
- 2.19. Sysinfo
- 2.20. Syscfg
- Chapter 3. PIO
- Chapter 4. Peripherals
- 4.1. USB
- 4.2. DMA
- 4.3. UART
- 4.4. I2C
- 4.4.1. Features
- 4.4.2. IP Configuration
- 4.4.3. I2C Overview
- 4.4.4. I2C Terminology
- 4.4.5. I2C Behaviour
- 4.4.6. I2C Protocols
- 4.4.7. Tx FIFO Management and START, STOP and RESTART Generation
- 4.4.8. Multiple Master Arbitration
- 4.4.9. Clock Synchronization
- 4.4.10. Operation Modes
- 4.4.11. Spike Suppression
- 4.4.12. Fast Mode Plus Operation
- 4.4.13. Bus Clear Feature
- 4.4.14. IC_CLK Frequency Configuration
- 4.4.15. DMA Controller Interface
- 4.4.16. List of Registers
- 4.5. SPI
- 4.5.1. Overview
- 4.5.2. Functional Description
- 4.5.3. Operation
- 4.5.3.1. Interface reset
- 4.5.3.2. Configuring the SSP
- 4.5.3.3. Enable PrimeCell SSP operation
- 4.5.3.4. Clock ratios
- 4.5.3.5. Programming the SSPCR0 Control Register
- 4.5.3.6. Programming the SSPCR1 Control Register
- 4.5.3.7. Frame format
- 4.5.3.8. Texas Instruments synchronous serial frame format
- 4.5.3.9. Motorola SPI frame format
- 4.5.3.10. Motorola SPI Format with SPO=0, SPH=0
- 4.5.3.11. Motorola SPI Format with SPO=0, SPH=1
- 4.5.3.12. Motorola SPI Format with SPO=1, SPH=0
- 4.5.3.13. Motorola SPI Format with SPO=1, SPH=1
- 4.5.3.14. National Semiconductor Microwire frame format
- 4.5.3.15. Examples of master and slave configurations
- 4.5.3.16. PrimeCell DMA interface
- 4.5.4. List of Registers
- 4.6. PWM
- 4.7. Timer
- 4.8. Watchdog
- 4.9. RTC
- 4.10. ADC and Temperature Sensor
- 4.11. SSI
- 4.11.1. Overview
- 4.11.2. Features
- 4.11.3. IP Modifications
- 4.11.4. Clock Ratios
- 4.11.5. Transmit and Receive FIFO Buffers
- 4.11.6. 32-Bit Frame Size Support
- 4.11.7. SSI Interrupts
- 4.11.8. Transfer Modes
- 4.11.9. Operation Modes
- 4.11.10. Partner Connection Interfaces
- 4.11.11. DMA Controller Interface
- 4.11.12. APB Interface
- 4.11.13. List of Registers
- Chapter 5. Electrical and Mechanical
- Appendix A: Register Field Types
- Appendix B: Errata
4.10.3.6. Interrupts
An interrupt can be generated when the FIFO level reaches a configurable threshold FCS.THRESH. The interrupt output
must be enabled via INTE.
Status can be read from INTS. The interrupt is cleared by draining the FIFO to a level lower than FCS.THRESH.
4.10.3.7. Supply
The ADC supply is separated out on its own pin to allow noise filtering.
4.10.4. Temperature Sensor
The temperature sensor measures the Vbe voltage of a biased bipolar diode, connected to the fifth ADC channel
(AINSEL=4). Typically, Vbe = 0.706V at 27 degrees C, with a slope of -1.721mV per degree. Therefore the temperature can
be approximated as follows:
T = 27 - (ADC_voltage - 0.706)/0.001721
As the Vbe and the Vbe slope can vary over the temperature range, and from device to device, some user calibration may
be required if accurate measurements are required.
The temperature sensor’s bias source must be enabled before use, via CS.TS_EN. This increases current consumption on
ADC_IOVDD by approximately 40 μA.
4.10.5. List of Registers
Table 593. List of ADC
registers
Offset Name Info
0x00 CS ADC Control and Status
0x04 RESULT Result of most recent ADC conversion
0x08 FCS FIFO control and status
0x0c FIFO Conversion result FIFO
0x10 DIV Clock divider. If non-zero, CS_START_MANY will start conversions
at regular intervals rather than back-to-back.
The divider is reset when either of these fields are written.
Total period is 1 + INT + FRAC / 256
0x14 INTR Raw Interrupts
0x18 INTE Interrupt Enable
0x1c INTF Interrupt Force
0x20 INTS Interrupt status after masking & forcing
CS Register
Description
ADC Control and Status
Table 594. CS Register
Bits Name Description Type Reset
31:21 Reserved. - - -
RP2040 Datasheet
4.10. ADC and Temperature Sensor 586