Data Sheet

W M B T 0 1 ( - s , - s c ) D a t a s h e e t
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Appendix
1. Storage Requirements
1.1 Temperature: 22~28℃；
1.2 Humidity: <70%（RH）；
Vacuum packed and sealed in good condition to ensure 12 months of welding.
2. Humidity Sensitive Characteristic
2.1 MSL: 3 level
2.2 Once opened, SMT within 168 hours in the condition of temperature: 22~28
℃ and humidity<60%（RH）. Once production line stops, modules should either be
stored in the drying box or be vacuum packed. If it fails to meet above storage
conditions, Bluetooth modules need drying. Drying parameters refer to Table 2-1.
2.3 Handling, storage, and processing should follow IPC/JEDECJ-STD-033
Table 2-1： Mounted or un-mounted SMD package drying reference condition
（User drying：Shop life starts after drying，Time=0）
Drying under 125℃
Drying under 90℃，≤5%RH
Drying under 40℃，≤5%RH
Over floor
life >72
hours
Over floor
life≤72
hours
Over floor
life >72
hours
Over floor
life≤72 hours
Over floor
life >72
hours
Over floor
life≤72 hours
9 hours
7 hours
33 hours
23 hours
13 days
9 days
3. PCB Design Instruction
3.1 PCB Pad Surface Treatment
ENIG（Chemistry Ni/Au）、OSP are recommended for PCB surface treatment. ENIG
（Chemistry Ni/Au）is preferred.
3.2 PCB Pad Design
3.2.1 In order to ensure high production efficiency and high reliability of solder
joints, PCB pad design refers to recommended PCB pad size in the corresponding
product specification.
3.2.2 Even only part of PINs are used, it is recommended to do full pad design,