Datasheet
Table Of Contents
- Document Information
- Contents
- 1 Functional description
- 2 Interfaces
- 3 Pin definition
- 4 Electrical specifications
- 4.1 Absolute maximum rating
- 4.2 Operating conditions
- 4.2.1 Operating temperature range
- 4.2.2 Supply/power pins
- 4.2.3 Current consumption
- 4.2.4 LTE RF characteristics
- 4.2.5 3G RF characteristics
- 4.2.6 2G RF characteristics
- 4.2.7 ANT_DET pin
- 4.2.8 PWR_ON pin
- 4.2.9 RESET_N pin
- 4.2.10 SIM pins
- 4.2.11 USB pins
- 4.2.12 HSIC pins
- 4.2.13 DDC (I2C) pins
- 4.2.14 Generic Digital Interfaces pins
- 5 Mechanical specifications
- 6 Qualification and approvals
- 7 Product handling & soldering
- 8 Default settings
- 9 Labeling and ordering information
- Appendix
- A Glossary
- Related documents
- Revision history
- Contact

LARA-R2 series - Data Sheet
UBX-16005783 - R15 Product handling & soldering Page 41 of 48
7.2 Moisture Sensitivity Levels
⚠ LARA-R2 series modules are Moisture Sensitive Devices (MSD) in accordance to the IPC/JEDEC
specification.
The Moisture Sensitivity Level (MSL) relates to the packaging and handling precautions required.
LARA-R2 series modules are rated at MSL level 4. For more information regarding moisture sensitivity
levels, labeling, storage and drying see the u-blox Package Information Guide [6].
☞ For the MSL standard, see IPC/JEDEC J-STD-020 (can be downloaded from www.jedec.org).
7.3 Reflow soldering
Reflow profiles are to be selected according to u-blox recommendations (see LARA-R2 series System
Integration Manual [2]).
⚠ Failure to observe these recommendations can result in severe damage to the device!
7.4 ESD precautions
⚠ LARA-R2 series modules contain highly sensitive electronic circuitry and are Electrostatic
Sensitive Devices (ESD). Handling LARA-R2 series modules without proper ESD protection may
destroy or damage them permanently.
LARA-R2 series modules are Electrostatic Sensitive Devices (ESD) and require special ESD
precautions typically applied to ESD sensitive components.
Table 7 details the maximum ESD ratings of the LARA-R2 series modules.
Proper ESD handling and packaging procedures must be applied throughout the processing, handling
and operation of any application that incorporates the LARA-R2 series module.
ESD precautions should be implemented on the application board where the module is mounted, as
described in the LARA-R2 series System Integration Manual [2].
⚠ Failure to observe these recommendations can result in severe damage to the device!










