Datasheet
RDA Microelectronics, Inc. RDA5807M FM Tuner V1.1
The information contained herein is the exclusive property of RDA and shall not be distributed, reproduced, or disclosed in whole or in
part without prior written permission of RDA.
Page 19 of 22
Package Thickness Volume mm
<350
3
Volume mm
≥
350
3
<
2.5mm 240 + 0/-5
o
225 + 0/-5 C
o
C
≥
2.5mm 225 + 0/-5
o
225 + 0/-5 C
o
C
Table – II SnPb Eutectic Process – Package Peak Reflow Temperatures
Package
Thickness
Volume mm
<
350
3
Volume mm
350-2000
3
Volume mm
>
2000
3
<1.6mm 260 + 0
o
260 + 0 C *
o
260 + 0 C *
o
C *
1.6mm – 2.5mm 260 + 0
o
250 + 0 C *
o
245 + 0 C *
o
C *
≥
2.5mm 250 + 0
o
245 + 0 C *
o
245 + 0 C *
o
C *
*Tolerance : The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature(this mean Peak reflow temperature + 0
o
C. For
example 260+ 0
o
C ) at the rated MSL Level.
Table – III Pb-free Process – Package Classification Reflow Temperatures
Note 1: All temperature refer topside of the package. Measured on the package body surface.
Note 2: The profiling tolerance is + 0
o
C, - X
o
is required to control the profile process but at no time will it exceed - 5
C (based on machine variation
capability)whatever
o
Note 3: Package volume excludes external terminals(balls, bumps, lands, leads) and/or non
integral heat sinks.
C. The
producer assures process compatibility at the peak reflow profile temperatures defined
in Table –III.
Note 4: The maximum component temperature reached during reflow depends on package the
thickness and volume. The use of convection reflow processes reduces the thermal
gradients between packages. However, thermal gradients due to differences in
thermal mass of SMD package may sill exist.
Note 5: Components intended for use in a “lead-free” assembly process shall be evaluated
using the “lead free” classification temperatures and profiles defined in Table-I II III
whether or not lead free.










