Datasheet
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PACKAGE OUTLINE
C
SEE TERMINAL
DETAIL
16X
0.3
0.2
2.6 0.1
16X
0.5
0.3
0.8 MAX
(A) TYP
0.05
0.00
12X 0.5
4X
1.5
B
4.1
3.9
A
4.1
3.9
0.3
0.2
0.5
0.3
WQFN - 0.8 mm max heightRGH0016A
PLASTIC QUAD FLATPACK - NO LEAD
4214978/B 01/2017
DIM A
OPT 1
OPT 1
(0.1) (0.2)
PIN 1 INDEX AREA
0.08
SEATING PLANE
1
4
9
12
5
8
16
13
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05
EXPOSED
THERMAL PAD
17
SYMM
SYMM
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for optimal thermal and mechanical performance.
SCALE 3.000
DETAIL
OPTIONAL TERMINAL
TYPICAL