Datasheet

5
LDC1612
,
LDC1614
www.ti.com
SNOSCY9A DECEMBER 2014REVISED MARCH 2018
Product Folder Links: LDC1612 LDC1614
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
MIN MAX UNIT
V
DD
Supply Voltage Range 5 V
V
i
Voltage on any pin -0.3 V
DD
+0.3 V
I
A
Input current on any INx pin -8 8 mA
I
D
Input current on any Digital pin -5 5 mA
T
j
Junction Temperature -55 150 °C
T
stg
Storage temperature range -65 150 °C
(1) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
LDC1612 in WSON-12 package
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(1)
±750
LDC1614 in WQFN-16 package
V
(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 ±2000
V
Charged-device model (CDM), per JEDEC specification JESD22-
C101
(1)
±750
6.3 Recommended Operating Conditions
Unless otherwise specified, all limits ensured for T
A
= 25°C, V
DD
= 3.3 V
MIN NOM MAX UNIT
V
DD
Supply Voltage 2.7 3.6 V
T
A
Operating Temperature -40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
6.4 Thermal Information
THERMAL METRIC
(1)
LDC1612 LDC1614
UNITWSON (DNT) WQFN (RGH)
12 PINS 16 PINS
R
θJA
Junction-to-ambient thermal resistance 50 38 °C/W