Datasheet
LDC1612 WSON-12
1
2
3
4
12
11
10
9
5
6
7
8
1
6
1
5
1
4
1
3
SDA
DAP
LDC1614 WQFN-16
SCL
CLKIN
ADDR IN0A
IN0B
IN1A
IN1B
INTB
SD
VDD
GND
IN3B
IN2B
IN3A
IN2A
DAP
1
SCL
3
CLKIN
4
ADDR
INTB
5
VDD
7
GND
8
IN0A
9
IN0B
10
IN1A
11
SD
6
IN1B
12
2
SDA
4
LDC1612
,
LDC1614
SNOSCY9A –DECEMBER 2014–REVISED MARCH 2018
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(1) I = Input, O = Output, P=Power, G=Ground, A=Analog
(2) There is an internal electrical connection between the exposed Die Attach Pad (DAP) and the GND pin of the device. Although the DAP
can be left floating, for best performance the DAP should be connected to the same potential as the device's GND pin. Do not use the
DAP as the primary ground for the device. The device GND pin must always be connected to ground.
5 Pin Configuration and Functions
DNT and RGH Packages
Top View
Pin Functions
PIN
TYPE
(1)
DESCRIPTION
NAME NO.
SCL 1 I I2C Clock input. Open drain output; requires resistive pullup to logic high level.
SDA 2 I/O I2C Data input/output. Open drain output; requires resistive pullup to logic high level.
CLKIN 3 I External Reference Clock input. Tie this pin to GND if internal oscillator is used.
ADDR
4 I
I2C Address selection pin: when ADDR=L, I2C address = 0x2A, when ADDR=H, I2C address =
0x2B. This input must not be allowed to float.
INTB 5 O Configurable Interrupt output pin. Push-pull output; does not require pullup.
SD
6 I
Shutdown input: set SD = L for normal operation, set SD=H for inactive mode. This input must
not be allowed to float.
VDD 7 P Power Supply
GND 8 G Ground
IN0A 9 A External LC sensor 0 connection
IN0B 10 A External LC sensor 0 connection
IN1A 11 A External LC sensor 1 connection
IN1B 12 A External LC sensor 1 connection
IN2A 13 A External LC sensor 2 connection (LDC1614 only)
IN2B 14 A External LC sensor 2 connection (LDC1614 only)
IN3A 15 A External LC sensor 3 connection (LDC1614 only)
IN3B 16 A External LC sensor 3 connection (LDC1614 only)
DAP
(2)
DAP N/A Connect to Ground