Datasheet
2
LDC1612
,
LDC1614
SNOSCY9A –DECEMBER 2014–REVISED MARCH 2018
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Product Folder Links: LDC1612 LDC1614
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information ................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics - I2C ................................. 7
6.7 Typical Characteristics.............................................. 8
7 Detailed Description............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 12
7.5 Programming........................................................... 13
7.6 Register Maps......................................................... 15
8 Application and Implementation ........................ 34
8.1 Application Information............................................ 34
8.2 Typical Application ................................................. 49
9 Power Supply Recommendations...................... 53
10 Layout................................................................... 54
10.1 Layout Guidelines ................................................. 54
10.2 Layout Example .................................................... 54
11 Device and Documentation Support ................. 55
11.1 Device Support...................................................... 55
11.2 Documentation Support ........................................ 55
11.3 Related Links ........................................................ 55
11.4 Receiving Notification of Documentation Updates 55
11.5 Community Resources.......................................... 55
11.6 Trademarks........................................................... 56
11.7 Electrostatic Discharge Caution............................ 56
11.8 Glossary................................................................ 56
12 Mechanical, Packaging, and Orderable
Information ........................................................... 56
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (December 2014) to Revision A Page
• Changed ESD values from 1000 to 2000 and from 250 to 750 on both packages................................................................ 5
• Added logic levels for ADDR, INTB, and SD pins. ................................................................................................................. 6
• Changed description of clocking architecture for improved clarity. ..................................................................................... 11
• Changed register names and field names from CHx_NAME and NAME_CHx to NAMEx. ................................................ 15
• Added instructions on setting registers with both R and R/W fields..................................................................................... 15
• Changed register names from DATA_MSB_CHx to DATAx_MSB; DATA_LSB_CHx register names to DATAx_LSB,
and CHx_ERR_YY field names to ERR_YYx. ..................................................................................................................... 16
• Changed ERR_AE field description on DATA_MSB_CH0, DATA_MSB_CH1, DATA_MSB_CH2 and
DATA_MSB_CH3 tables....................................................................................................................................................... 16
• Changed register names from RCOUNT_CHx to RCOUNTx; and CHx_RCOUNT field names to RCOUNTx .................. 20
• Changed register names from OFFSET_CHx to OFFSETx; and CHx_OFFSET field names to OFFSETx ...................... 21
• Changed register names from SETTLECOUNT_CHx to SETTLECOUNTx; and CHx_SETTLECOUNT field names to
SETTLECOUNTx ................................................................................................................................................................. 22
• Changed Address of SETTLECOUNT0 and SETTLECOUNT1 were not correct on table. ................................................ 23
• Changed register names from CLOCK_DIVIDERS_CHx to CLOCK_DIVIDERSx; CHx_FIN_DIVIDER field names to
FIN_DIVIDERx, and CHx_FREF_DIVIDER field names to FREF_DIVIDERx. ................................................................... 24
• Changed CHx_UNREADCONV field names to UNREADCONVx ...................................................................................... 26
• Changed register names from DRIVE_CURRENT_CHx to DRIVE_CURRENTx; CHx_IDRIVE field names to
IDRIVEx, and CHx_INIT_IDRIVE to INIT_IDRIVEx ............................................................................................................ 31
• Changed Application Information section for clarity, and provided additional information on device configuration and
operation. ............................................................................................................................................................................. 34
• Changed Equations in the L-C Resonators section. ............................................................................................................ 35
• Changed R
P
to R
S
in Equation ............................................................................................................................................ 35
• Changed IDRIVEx values..................................................................................................................................................... 42
• Added instructions for using an oscilloscope to configure sensor drive current .................................................................. 44