Datasheet

MCP9600
DS20005426C-page 44  2015-2017 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Microchip Technology Drawing C04-286B
20-Lead More Thin Plastic Quad Flat, No Lead Package (NU) - 5x5x1.0 mm Body
SILK SCREEN
1
2
20
Thermal Via Diameter V
Thermal Via Pitch EV
0.30
1.00
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C1
Optional Center Pad Width
Contact Pad Spacing
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
C2
T2
W2
3.35
3.35
MILLIMETERS
0.65 BSC
MIN
E
MAX
4.50
4.50
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.55
0.40
GDistance Between Pads 0.20
NOM
[MQFN] - (Also called VQFN)
C1
C2
EV
EV
E
X2
Y2
ØV
G
Y1
X1